公开(公告)号：US20170077042A1

公开(公告)日：2017-03-16

申请号：US15362258

申请日：2016-11-28

申请人： Apic Yamada Corporation

发明人： Kazuhiko KOBAYASHI ,  Keisuke SUDA

IPC分类号： H01L23/552 ,  H01L21/3205 ,  H01L23/00 ,  H01L21/326

CPC分类号： H01L23/552 ,  B05B5/025 ,  B05B5/14 ,  B29C33/58 ,  B29C33/72 ,  G03F7/0002 ,  G03F7/164 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/326 ,  H01L21/6715 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/76 ,  H01L24/82 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8592 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

摘要： Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

摘要翻译： 提供了一种使用能够在工件上形成厚度均匀的薄膜的静电喷涂装置的抗蚀剂膜形成装置。 通过静电喷涂在基板上形成抗蚀剂膜（108）的抗蚀膜形成装置（100）包括：喷嘴（102），其在施加规定电压时喷射形成原料的液体颗粒 抗蚀剂膜（108）朝向具有台阶部（105a）的基板（105）。 用于引起所述基板（105）或所述喷嘴（102）的相对运动的驱动装置（111）; 以及控制装置（110），用于控制使得通过液体颗粒在具有台阶部分（105a）的基板（105）上形成抗蚀剂膜（108）。

公开(公告)号：US09543224B1

公开(公告)日：2017-01-10

申请号：US14964494

申请日：2015-12-09

申请人： INTEL IP CORPORATION

发明人： Thorsten Meyer ,  Gerald Ofner ,  Robert L. Sankman

IPC分类号： H01L23/48 ,  H01L21/66 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L21/60

CPC分类号： H01L22/20 ,  H01L21/4853 ,  H01L21/568 ,  H01L22/12 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/20 ,  H01L24/76 ,  H01L24/96 ,  H01L24/97 ,  H01L2021/60292 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1421 ,  H01L2924/18162

摘要： Semiconductor packages and methods, systems, and apparatuses of forming such packages are described. A method of forming a semiconductor package may include encapsulating a semiconductor die with a molding compound, applying a seed layer on the die and the molding compound, applying a resist layer on the seed layer, exposing a first portion of the resist layer, and exposing a second portion of the resist layer. The first portion can include a first area of the resist layer to be used for forming a redistribution layer (RDL) without including a second area of the resist layer to be used for forming an electrical communications pathway between at least one of the contact pads and the RDL. The second portion can include the second area of the resist layer that includes the electrical communications pathway.

摘要翻译： 描述了形成这种封装的半导体封装和方法，系统和装置。 形成半导体封装的方法可以包括用模塑料包封半导体管芯，在晶粒上施加种子层和模塑料，在种子层上施加抗蚀剂层，暴露抗蚀剂层的第一部分，并暴露 抗蚀剂层的第二部分。 第一部分可以包括用于形成再分布层（RDL）的抗蚀剂层的第一区域，而不包括用于在至少一个接触焊盘和至少一个接触焊盘之间形成电通信路径的抗蚀剂层的第二区域 RDL。 第二部分可以包括包括电通信路径的抗蚀剂层的第二区域。

公开(公告)号：US09245875B2

公开(公告)日：2016-01-26

申请号：US14394501

申请日：2013-04-19

申请人： Rensselaer Polytechnic Institute

发明人： Robert F. Karlicek ,  James Jian-Qiang Lu ,  Charles Sanford Goodwin ,  Anton Tkachenko

IPC分类号： H01L25/075 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L25/50 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/76 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0753 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/04026 ,  H01L2224/05655 ,  H01L2224/13101 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/75252 ,  H01L2224/75283 ,  H01L2224/75655 ,  H01L2224/75701 ,  H01L2224/75733 ,  H01L2224/75801 ,  H01L2224/76655 ,  H01L2224/76701 ,  H01L2224/76733 ,  H01L2224/76801 ,  H01L2224/82002 ,  H01L2224/82102 ,  H01L2224/82143 ,  H01L2224/83002 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/8323 ,  H01L2224/83801 ,  H01L2224/9202 ,  H01L2224/95101 ,  H01L2224/95144 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/3511 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2924/00014

摘要： Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.

公开(公告)号：US20150303151A1

公开(公告)日：2015-10-22

申请号：US14648587

申请日：2013-11-11

申请人： APIC YAMADA CORPORATION

发明人： Kazuhiko KOBAYASHI ,  Keisuke SUDA

IPC分类号： H01L23/552 ,  H05K1/11 ,  H01L21/321 ,  H01L21/3205

CPC分类号： H01L23/552 ,  B05B5/025 ,  B05B5/14 ,  B29C33/58 ,  B29C33/72 ,  G03F7/0002 ,  G03F7/164 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/326 ,  H01L21/6715 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/76 ,  H01L24/82 ,  H01L24/85 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

摘要： Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

摘要翻译： 提供了一种使用能够在工件上形成厚度均匀的薄膜的静电喷涂装置的抗蚀剂膜形成装置。 通过静电喷涂在基板上形成抗蚀剂膜（108）的抗蚀膜形成装置（100）包括：喷嘴（102），其在施加规定电压时喷射形成原料的液体颗粒 抗蚀剂膜（108）朝向具有台阶部（105a）的基板（105）。 用于引起所述基板（105）或所述喷嘴（102）的相对运动的驱动装置（111）; 以及控制装置（110），用于控制使得通过液体颗粒在具有台阶部分（105a）的基板（105）上形成抗蚀剂膜（108）。

公开(公告)号：US08969197B2

公开(公告)日：2015-03-03

申请号：US13475526

申请日：2012-05-18

申请人： Daniel C. Edelstein ,  Takeshi Nogami ,  Christopher Parks ,  Tsong-Lin Tai

发明人： Daniel C. Edelstein ,  Takeshi Nogami ,  Christopher Parks ,  Tsong-Lin Tai

IPC分类号： H01L21/44

CPC分类号： H01L23/53238 ,  H01L21/76849 ,  H01L21/76867 ,  H01L21/76883 ,  H01L23/522 ,  H01L23/53209 ,  H01L23/5329 ,  H01L23/53295 ,  H01L24/76 ,  H01L24/82 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure with improved electromigration resistance and methods for making the same. A structure having improved electromigration resistance includes a bulk interconnect having a dual layer cap and a dielectric capping layer. The dual layer cap includes a bottom metallic portion and a top metal oxide portion. Preferably the metal oxide portion is MnO or MnSiO and the metallic portion is Mn or CuMn. The structure is created by doping the interconnect with an impurity (Mn in the preferred embodiment), and then creating lattice defects at a top portion of the interconnect. The defects drive increased impurity migration to the top surface of the interconnect. When the dielectric capping layer is formed, a portion reacts with the segregated impurities, thus forming the dual layer cap on the interconnect. Lattice defects at the Cu surface can be created by plasma treatment, ion implantation, a compressive film, or other means.

摘要翻译： 具有改进的电迁移阻力的结构及其制造方法。 具有改进的电迁移电阻的结构包括具有双层盖和介电覆盖层的体互连。 双层帽包括底部金属部分和顶部金属氧化物部分。 优选地，金属氧化物部分是MnO或MnSiO，金属部分是Mn或CuMn。 通过用杂质（在优选实施例中为Mn）掺杂互连，然后在互连的顶部处产生晶格缺陷来产生该结构。 这些缺陷驱使增加的杂质向互连顶表面迁移。 当形成电介质盖层时，一部分与分离的杂质反应，从而在互连上形成双层盖。 Cu表面的晶格缺陷可以通过等离子体处理，离子注入，压缩薄膜或其他方式产生。

公开(公告)号：US08846456B2

公开(公告)日：2014-09-30

申请号：US12310539

申请日：2007-08-29

申请人： Karl Weidner

发明人： Karl Weidner

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H05K3/28

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3164 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2203/0537 ,  H05K2203/063 ,  H05K2203/074 ,  H05K2203/1311

摘要： A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.

摘要翻译： 具有布置在其上的至少一个组件（例如半导体芯片）的衬底由层压到衬底的表面上的塑料材料制成的薄膜和至少一个组件制成，其中表面具有至少一个触点 区。 首先，将要层压在基材表面上的薄膜和至少一种组分或包含该薄膜的薄膜复合材料布置在室中，使得该腔室被薄膜或薄膜复合材料分裂成第一腔室部分 以及第二室部分，其与第一室部分隔离以便气密。 在第一室部分中比在第二室部分中提供或产生更高的大气压力; 并且在布置在第二室部分中的基板的表面与至少一个部件以及膜或膜复合物之间形成接触，该接触引起膜在表面上的层压。

公开(公告)号：US20140069697A1

公开(公告)日：2014-03-13

申请号：US13990823

申请日：2011-12-02

申请人： Jeroen Van Den Brand ,  Roel Henry Louis Kusters ,  Andreas Heinrich Dietzel

发明人： Jeroen Van Den Brand ,  Roel Henry Louis Kusters ,  Andreas Heinrich Dietzel

IPC分类号： H05K3/32 ,  H05K1/02

CPC分类号： H05K3/32 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/76155 ,  H01L2224/76261 ,  H01L2224/766 ,  H01L2224/767 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/82874 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/12 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1469 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49133 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method.In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

摘要翻译： 提出了一种用于将组件（30）与柔性基板（10）组装的方法，该部件具有电触点（31）。 该方法包括以下步骤：将组件（30）放置在衬底的第一主侧（11）上，施加机器视觉步骤以估计电触点的位置，沉积导电的一个或多个层（32） 材料或其前体，所述层在由所述部件限定的衬底的区域上延伸到横向超过所述区域，根据所述电触点的估计位置计算划分线，通过局部将所述层划分为相互绝缘的区域（32d） 沿着所述分隔线从所述层去除材料。 还提出了适合于执行该方法的装置。 此外，存在可以通过根据本发明的方法和装置获得的组件。

公开(公告)号：US20140054795A1

公开(公告)日：2014-02-27

申请号：US13591719

申请日：2012-08-22

申请人： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

发明人： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

摘要： One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

摘要翻译： 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。

公开(公告)号：US07805836B2

公开(公告)日：2010-10-05

申请号：US11939644

申请日：2007-11-14

申请人： Tsuyoshi Shintate

发明人： Tsuyoshi Shintate

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/10674 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00

摘要： A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.

摘要翻译： 电子板的制造方法包括：将导电部件的电子部件放置在导电部件朝上的第一绝缘层上，并且在导电部件上设置具有导电性的突起部; 通过液滴喷射方法施加绝缘材料，该方法在躲避突起的同时在电子部件的上表面上提供第二绝缘层，第二绝缘层具有从该层突出的高度; 提供要连接到第二层上的突起的导电布线; 以及通过所述液滴喷射方法将所述绝缘材料施加在所述电子部件周围，以提供具有大致等于所述第二绝缘层的高度的第三绝缘层。

公开(公告)号：US20070286946A1

公开(公告)日：2007-12-13

申请号：US11797115

申请日：2007-05-01

申请人： Nobuhito Yamaguchi ,  Yuji Tsuruoka ,  Takashi Mori ,  Masao Furukawa ,  Seiichi Kamiya

发明人： Nobuhito Yamaguchi ,  Yuji Tsuruoka ,  Takashi Mori ,  Masao Furukawa ,  Seiichi Kamiya

IPC分类号： H01L23/00

CPC分类号： H01L23/5389 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/2518 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/185 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/09845 ,  H05K2201/10674 ,  H05K2203/0568 ,  Y10T29/53174

摘要： An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

摘要翻译： 本发明的目的是提供一种能够进行密集安装和减少布线距离的布线模块。 根据本发明的布线模块包括基底材料，多个电子电路部件，绝缘部分和连接到电子电路部件的导电部分，多个电子电路部件，绝缘部分和导电部分是 一体地保持在基材上。 电线由导体部分的叠层构成，并且在与基材的表面交叉的方向上并且与垂直于基材表面的方向交叉的方向延伸，以将多个电子电路部件电连接在一起。