公开(公告)号：US11581123B2

公开(公告)日：2023-02-14

申请号：US16937498

申请日：2020-07-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Huang-Hsien Chang ,  Yunghsun Chen

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F27/40 ,  H05K3/30 ,  H05K3/46 ,  H01F41/04 ,  H05K1/18

Abstract: An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

公开(公告)号：US11848143B2

公开(公告)日：2023-12-19

申请号：US17065482

申请日：2020-10-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yunghsun Chen ,  Huang-Hsien Chang ,  Shao Hsuan Chuang

IPC: H01F27/24 ,  H01F27/28 ,  H01F27/40 ,  H01F41/04 ,  H01G4/30

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F27/40 ,  H01F41/041 ,  H01G4/30

Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.