公开(公告)号：US11682631B2

公开(公告)日：2023-06-20

申请号：US17346068

申请日：2021-06-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Zheng Wei Wu

IPC: H01L23/552 ,  H01L21/768 ,  H01L21/78 ,  H01L21/50 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L21/768 ,  H01L21/78 ,  H01L24/14 ,  H01L2924/3025

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

公开(公告)号：US12300630B2

公开(公告)日：2025-05-13

申请号：US18212162

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Zheng Wei Wu

IPC: H01L23/552 ,  H01L21/50 ,  H01L21/768 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.