公开(公告)号：US11101194B2

公开(公告)日：2021-08-24

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H01L23/473 ,  F28F13/06 ,  H05K7/20

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

公开(公告)号：US20200029463A1

公开(公告)日：2020-01-23

申请号：US16470961

申请日：2017-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Yong Han ,  Boon Long Lau ,  Daniel Minwo Rhee

IPC: H05K7/20 ,  F28F13/06

Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.