公开(公告)号：US11177318B2

公开(公告)日：2021-11-16

申请号：US16962187

申请日：2019-01-28

Applicant: Agency for Science, Technology and Research

Inventor： Teck Guan Lim ,  Hideaki Fukuzawa ,  Hang Liu

IPC: H01L27/22 ,  H01L23/498 ,  H01L23/00 ,  H01L43/02

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.

公开(公告)号：US20200350363A1

公开(公告)日：2020-11-05

申请号：US16962187

申请日：2019-01-28

Applicant: Agency for Science, Technology and Research

Inventor： Teck Guan Lim ,  Hideaki Fukuzawa ,  Hang Liu

IPC: H01L27/22 ,  H01L23/498 ,  H01L43/02 ,  H01L23/00

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.