公开(公告)号：US20160157992A1

公开(公告)日：2016-06-09

申请号：US14905169

申请日：2014-07-21

Applicant: NATIONAL UNIVERSITY OF SINGAPORE ,  AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Cho Hong James GOH ,  Kok Hiong Thomas TEH ,  Pujiang SHI ,  Hoi Po James HUI ,  Jun LI

IPC: A61F2/08

CPC classification number: A61F2/08 ,  A61F2002/087 ,  A61F2210/0076 ,  A61F2240/001 ,  A61L27/3604 ,  A61L27/3834 ,  A61L27/46 ,  A61L27/48 ,  A61L27/54 ,  A61L27/56 ,  A61L2300/414

Abstract: The present invention relates to a device for the interfacial augmentation of tissue grafts for the purpose of tendon and ligament reconstruction. The inventive device works both as a delivery vessel for osteoconductive and osteoinductive factors and as a scaffold to stimulate and support bone ingrowth and comprises a tubular composite silk sheath, said tubular composite silk sheath comprising: a backbone consisting of a tubular silk mesh, and a carrier material consisting of a porous silk sponge, wherein said tubular silk mesh consists of degummed silk fibroin fibers, wherein said porous silk sponge comprises silk fibroin fibers and hydroxyapatite particles and said tubular silk mesh and said porous silk sponge form a composite material. The present invention is also directed to a method for the manufacturing of such augmentation devices, a method for fixation of the thus fabricated tissue interface augmentation devices onto ligament or tendon grafts, a method for applying such devices for ligament and/or tendon reconstruction to tendon grafts, as well as their application in ligament and tendon reconstruction.

Abstract translation: 本发明涉及用于腱和韧带重建的组织移植物的界面增大的装置。 本发明的装置既用作骨传导和骨诱导因子的输送容器，也用作刺激和支撑骨向内生长的支架，并且包括管状复合丝鞘，所述管状复合丝鞘包括：由管状丝网组成的骨架和 载体材料由多孔丝绸海绵组成，其中所述管状丝网由脱胶丝素蛋白纤维组成，其中所述多孔丝海绵包括丝素蛋白纤维和羟基磷灰石颗粒，所述管状丝网和所述多孔丝海绵形成复合材料。 本发明还涉及一种用于制造这种增强装置的方法，用于将如此制造的组织界面增强装置固定到韧带或腱移植物上的方法，将这种装置用于将韧带和/或肌腱重建应用于腱的方法 移植物，以及其在韧带和肌腱重建中的应用。

公开(公告)号：US20140231784A1

公开(公告)日：2014-08-21

申请号：US14263928

申请日：2014-04-28

Applicant: Agency for Science, Technology and Research

Inventor： Zhikuan CHEN ,  Jun LI ,  Beng ONG ,  Samarendra P. SINGH ,  Hoi Kai Ivy WONG ,  Kok Haw ONG

IPC: H01L51/00

CPC classification number: H01L51/0036 ,  B82Y10/00 ,  C07D285/14 ,  C07D333/10 ,  C07D333/28 ,  C07D417/14 ,  C07D495/14 ,  C08G61/126 ,  C08G2261/3223 ,  C08G2261/3246 ,  C08G2261/364 ,  H01L51/0047 ,  H01L51/0525 ,  H01L51/0545 ,  H01L51/4253 ,  Y02E10/549

Abstract: A polymer comprises a polymeric chain represented by formula (I) or (II). In formula (I) a, b, d, and n are integers, a from 0 to 3, b from 1 to 5, c from 1 to 3, d from 1 to 5, and n from 2 to 5000; R1 and R2 are side chains; R3 and R4 are each independently H or a side chain; and when a is 0, R3 and R4 are side chains. In formula (II), a, b, c, d, e, and n are integers, a from 1 to 3, b and c being independently 0 or 1, d and e being independently 1 or 2, and n from 2 to 5000; R1 and R2 are side chains except —COOalkyl; and X1, X2 and X3 are independently O, S, or Se. Semiconductors and devices comprising the polymer are also provided.

Abstract translation: 聚合物包含由式（I）或（II）表示的聚合物链。 在式（I）中，a，b，d和n为整数，a为0至3，b为1至5，c为1至3，d为1至5，n为2至5000; R1和R2是侧链; R3和R4各自独立地为H或侧链; 当a为0时，R 3和R 4为侧链。 在式（II）中，a，b，c，d，e和n为整数，a为1至3，b和c独立地为0或1，d和e独立地为1或2，n为2至 5000; R1和R2是除-COO烷基以外的侧链; X 1，X 2和X 3独立地为O，S或Se。 还提供了包含聚合物的半导体和器件。

公开(公告)号：US20180026196A1

公开(公告)日：2018-01-25

申请号：US15716303

申请日：2017-09-26

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Jun LI ,  Kok Haw ONG ,  Zhikuan CHEN ,  Yujun ZHAO ,  Siew Lay LIM ,  Ivy WONG ,  Lee YANG ,  Kang Yee SEAH

IPC: H01L51/00 ,  C08G75/32 ,  C09D5/24 ,  H01L51/42 ,  C08L65/00 ,  C08K3/04 ,  C08G61/12

CPC classification number: H01L51/0036 ,  C08G61/123 ,  C08G61/126 ,  C08G75/32 ,  C08G2261/124 ,  C08G2261/1412 ,  C08G2261/143 ,  C08G2261/3142 ,  C08G2261/3223 ,  C08G2261/3246 ,  C08G2261/364 ,  C08G2261/414 ,  C08G2261/91 ,  C08K3/045 ,  C08L65/00 ,  C09D5/24 ,  H01L51/0002 ,  H01L51/0007 ,  H01L51/0037 ,  H01L51/0043 ,  H01L51/4253 ,  H01L2251/308 ,  Y02E10/549 ,  Y02P70/521 ,  C08K3/04

Abstract: There is provided p-type organic polymers of general formula I. The polymers may be useful as semi-conducting material. Thus, thin films and devices comprising such polymers are also provided.

公开(公告)号：US20150349257A1

公开(公告)日：2015-12-03

申请号：US14655716

申请日：2013-12-27

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Jun LI ,  Kok Haw ONG ,  Zhikuan CHEN ,  Yujun ZHAO ,  Siew Lay LIM ,  Ivy WONG ,  Lee YANG ,  Kang Yee SEAH

IPC: H01L51/00 ,  C08G75/32 ,  H01L51/42 ,  C09D5/24

CPC classification number: H01L51/0036 ,  C08G61/123 ,  C08G61/126 ,  C08G75/32 ,  C08G2261/124 ,  C08G2261/1412 ,  C08G2261/143 ,  C08G2261/3142 ,  C08G2261/3223 ,  C08G2261/3246 ,  C08G2261/364 ,  C08G2261/414 ,  C08G2261/91 ,  C08K3/04 ,  C08K3/045 ,  C08L65/00 ,  C09D5/24 ,  H01L51/0002 ,  H01L51/0007 ,  H01L51/0037 ,  H01L51/0043 ,  H01L51/4253 ,  H01L2251/308 ,  Y02E10/549

Abstract: There is provided p-type organic polymers of general formula I. The polymers may be useful as semi-conducting material. Thus, thin films and devices comprising such polymers are also provided.

Abstract translation: 提供通式I的p型有机聚合物。该聚合物可用作半导体材料。 因此，还提供了包含这种聚合物的薄膜和器件。