Sputtering system and method
    4.
    发明授权

    公开(公告)号:US11257663B2

    公开(公告)日:2022-02-22

    申请号:US16645512

    申请日:2018-09-11

    Abstract: A sputtering system and a sputtering method are provided. The sputtering system includes a first electrode, a magnet and a second electrode. The first electrode is an elongated tube having a first end and a second end downstream of the first end. The first end is configured to receive a gas flow and the second end is placed next to a substrate. The magnet surrounds at least a portion of the elongated tube and is configured to generate a magnetic field in a space within the elongated tube. The second electrode is disposed within the elongated tube. A voltage is configured to be applied between the first and second electrodes to generate an electric field between the first and second electrodes.

    SPUTTERING SYSTEM AND METHOD
    5.
    发明申请

    公开(公告)号:US20200279723A1

    公开(公告)日:2020-09-03

    申请号:US16645512

    申请日:2018-09-11

    Abstract: A sputtering system and a sputtering method are provided. The sputtering system includes a first electrode, a magnet and a second electrode. The first electrode is an elongated tube having a first end and a second end downstream of the first end. The first end is configured to receive a gas flow and the second end is placed next to a substrate. The magnet surrounds at least a portion of the elongated tube and is configured to generate a magnetic field in a space within the elongated tube. The second electrode is disposed within the elongated tube. A voltage is configured to be applied between the first and second electrodes to generate an electric field between the first and second electrodes.

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