公开(公告)号：US20030150898A1

公开(公告)日：2003-08-14

申请号：US10387846

申请日：2003-03-13

Applicant: Agere Systems Inc.

Inventor： Dean P. Kossives ,  Ashraf W. Lotfi ,  Lynn F. Schneemeyer ,  Michael L. Steigerwald ,  R. Bruce Van Dover

IPC: B23K001/00

CPC classification number: H01L23/645 ,  H01F17/0006 ,  H01F41/046 ,  H01L23/5227 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.

Abstract translation: 本发明提供一种具有铁磁芯的功率微磁集成电路及其制造方法和采用该功率处理电路的功率处理电路，其包括：（1）基板; （2）耦合到所述衬底的绝缘体和（3）金属粘合剂，其在所述绝缘体和所述铁磁芯之间形成结合，以将所述铁磁芯固定到所述衬底。