公开(公告)号：US20100319967A1

公开(公告)日：2010-12-23

申请号：US12666437

申请日：2007-06-28

申请人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

发明人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

IPC分类号： H05K1/09 ,  B05D3/02 ,  C22F1/08 ,  B23K31/02 ,  B32B15/01

CPC分类号： H05K3/244 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01327 ,  H01L2924/3025 ,  H05K3/3463 ,  H05K2203/1105 ,  Y10T428/12715 ,  H01L2924/00 ,  H01L2924/00014

摘要： A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.

摘要翻译： 一种器件制造方法，根据该器件制造方法，与用于将器件电连接到外部布线的镀铜焊盘或引脚相邻形成锡 - 铜合金层。 有利地，锡 - 铜合金层在焊料回流过程中抑制铜溶解，因为该层在典型的回流焊条件下基本上不溶于液体Sn-Ag-Cu（锡 - 银 - 铜）焊料合金，因此屏蔽铜电镀 与液化焊料直接接触。