公开(公告)号：US20100319967A1

公开(公告)日：2010-12-23

申请号：US12666437

申请日：2007-06-28

申请人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

发明人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

IPC分类号： H05K1/09 ,  B05D3/02 ,  C22F1/08 ,  B23K31/02 ,  B32B15/01

CPC分类号： H05K3/244 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01327 ,  H01L2924/3025 ,  H05K3/3463 ,  H05K2203/1105 ,  Y10T428/12715 ,  H01L2924/00 ,  H01L2924/00014

摘要： A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.

摘要翻译： 一种器件制造方法，根据该器件制造方法，与用于将器件电连接到外部布线的镀铜焊盘或引脚相邻形成锡 - 铜合金层。 有利地，锡 - 铜合金层在焊料回流过程中抑制铜溶解，因为该层在典型的回流焊条件下基本上不溶于液体Sn-Ag-Cu（锡 - 银 - 铜）焊料合金，因此屏蔽铜电镀 与液化焊料直接接触。

公开(公告)号：US20060108681A1

公开(公告)日：2006-05-25

申请号：US11088046

申请日：2005-03-23

申请人： Kok Chua ,  Adesoji Dairo ,  Michael Diberardino ,  Ebyson Thomas ,  Jeffrey Weiss ,  Zhengpeng Xiong

发明人： Kok Chua ,  Adesoji Dairo ,  Michael Diberardino ,  Ebyson Thomas ,  Jeffrey Weiss ,  Zhengpeng Xiong

IPC分类号： H01L23/10

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat dissipating element is preferably made by stamping, and is formed from an essentially uniform thickness heat conducting sheet. The element is formed so as to have two portions of different heights, the portion with the smaller height overlying but not touching the semiconductor component or wires connecting the semiconductor component.

摘要翻译： 公开了一种半导体元件封装及其制造方法。 该封装采用在部件上嵌入保护材料内的散热元件。 散热元件优选通过冲压制成，并且由基本均匀的厚度的导热片形成。 元件形成为具有不同高度的两个部分，具有较小高度的部分覆盖但不接触连接半导体部件的半导体部件或导线。