公开(公告)号：US08357566B2

公开(公告)日：2013-01-22

申请号：US11510026

申请日：2006-08-25

申请人： Ai-Chie Wang ,  Choon Kuan Lee ,  Chin Hui Chong ,  Wuu Yean Tay

发明人： Ai-Chie Wang ,  Choon Kuan Lee ,  Chin Hui Chong ,  Wuu Yean Tay

IPC分类号： H01L21/00

CPC分类号： H01L23/495 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.

摘要翻译： 公开了适用于微电子器件封装的预封装引线框架。 单独的引线框架可以包括一组多个引线并排布置，其中相邻引线彼此间隔开相应的间隙。 封装化合物至少部分地封装该组引线指而不封装微电子器件。 封装化合物通常可以填充两个相邻引线指之间的多个间隙。

公开(公告)号：US20080048301A1

公开(公告)日：2008-02-28

申请号：US11510026

申请日：2006-08-25

申请人： Ai-Chie Wang ,  Choon Kuan Lee ,  Chin Hui Chong ,  Wuu Yean Tay

发明人： Ai-Chie Wang ,  Choon Kuan Lee ,  Chin Hui Chong ,  Wuu Yean Tay

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.

摘要翻译： 公开了适用于微电子器件封装的预封装引线框架。 单独的引线框架可以包括一组多个引线并排布置，其中相邻引线彼此间隔开相应的间隙。 封装化合物至少部分地封装该组引线指而不封装微电子器件。 封装化合物通常可以填充两个相邻引线指之间的多个间隙。

公开(公告)号：US07612436B1

公开(公告)日：2009-11-03

申请号：US12183981

申请日：2008-07-31

申请人： Teck Kheng Lee ,  Voon Siong Chin ,  Ai-Chie Wang

发明人： Teck Kheng Lee ,  Voon Siong Chin ,  Ai-Chie Wang

IPC分类号： H01L23/495 ,  H05K5/02

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2224/05599

摘要： Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.

摘要翻译： 本文公开了用于制造封装的微电子器件的封装的微电子器件和方法。 在一个实施例中，封装的微电子器件可以包括支撑构件和附接到支撑构件的堆叠构造中的至少一个模具。 支撑构件可以包括纵向设置在第一和第二端之间并且纬向地在第一和第二侧之间的引线框架。 引线框架包括在第一端和第一侧之间延伸的引线。