公开(公告)号：US20100086754A1

公开(公告)日：2010-04-08

申请号：US12637481

申请日：2009-12-14

申请人： Akihiro Iikuma ,  Hideaki Shinozaki ,  Masahiro Kikuchi ,  Tatsuya Otsuka ,  Taiichi Kubo ,  Kazuhisa Ono

发明人： Akihiro Iikuma ,  Hideaki Shinozaki ,  Masahiro Kikuchi ,  Tatsuya Otsuka ,  Taiichi Kubo ,  Kazuhisa Ono

IPC分类号： B32B3/10

CPC分类号： H05K3/207 ,  B44C1/1712 ,  H05K1/092 ,  H05K3/386 ,  H05K2201/0195 ,  H05K2203/0156 ,  H05K2203/0783 ,  Y10T428/24893

摘要： A transfer film for firing which has a multilayer structure including a functional pattern and a pressure-sensitive adhesive layer. The multilayer structure is free from a shape failure of the functional pattern and a decrease in adhesive force of the adhesive layer, and has the excellent transferability to a substrate. The transfer film gives a fired functional pattern free from defects such as a shape or function failure. The transfer film for firing is one for use in forming a fired functional pattern by transferring a multilayer structure including a functional pattern to a surface of a substrate and firing it. The transfer film comprises a release film and a multilayer structure formed so as to be in contact with one of the surfaces of the release film. The multilayer structure includes a functional pattern and a contact layer which has been formed so as to be in direct contact with the surface of the functional pattern and is constituted of one layer or a larger number of layers. The functional pattern comprises inorganic particles and an organic substance removable by firing. The contact layer comprises an organic substance and a solvent both removable by firing. The organic substance contained in the functional pattern is incompatible with the solvent contained in the contact layer.

摘要翻译： 一种具有包括功能图案和压敏粘合剂层的多层结构的烧制用转印膜。 多层结构没有功能图案的形状破坏和粘合剂层的粘合力的降低，并且对基材具有优异的转移性。 转印膜具有没有诸如形状或功能故障的缺陷的烧制功能图案。 用于焙烧的转印膜是通过将包括功能图案的多层结构转移到基板的表面并烧制来形成烧制的功能图案的转印膜。 转印膜包括脱模膜和形成为与剥离膜的一个表面接触的多层结构。 多层结构包括功能图案和形成为与功能图案的表面直接接触并由一层或多层构成的接触层。 功能图案包括无机颗粒和通过焙烧除去的有机物质。 接触层包括可通过烧制除去的有机物质和溶剂。 包含在功能图案中的有机物质与接触层中所含的溶剂不相容。