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公开(公告)号：US06178580B2
公开(公告)日：2001-01-30
申请号：US09299628
申请日：1999-04-27
IPC分类号： A46B1304
CPC分类号： H01L21/67046
摘要： A drive unit 42 for driving a brush 8 is provided on a tip of a rotatable arm 26. The drive unit 42 includes a motor 61 for driving the processing member 24 having a brush 58 for rotation and an adjustment mechanism 45 for adjusting a force to urge the processing member 24 against a wafer W. With no intermediary of a flexible transmitting means, such as a belt, the processing member 24 is securely joined to the motor 61 through a shaft 55 and driven by the motor 61 directly. The adjustment mechanism 45 is constituted by an electromagnetic actuator which includes a stationary element 46 and a movable element 48 capable of elevating along the stationary element 46. The motor 61 is coupled to the armature 48. The adjustment mechanism 45 controls the position of the processing member 24 with respect to the upward and downward direction as well as the force to urge the processing member 24 against a wafer W.
摘要翻译： 用于驱动刷子8的驱动单元42设置在可旋转臂26的尖端上。驱动单元42包括用于驱动具有用于旋转的刷子58的处理构件24的马达61和用于调节力的调节机构45 将加工构件24推向晶片W.在没有诸如带之类的柔性传输装置的介质的情况下，处理构件24通过轴55牢固地接合到马达61，并由马达61直接驱动。 调节机构45由电磁致动器构成，电磁致动器包括固定元件46和能够沿着固定元件46升高的可移动元件48.马达61联接到电枢48.调节机构45控制处理的位置 构件24相对于向上和向下方向以及将处理构件24推向晶片W的力。
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公开(公告)号：US06292972B1
公开(公告)日：2001-09-25
申请号：US09281531
申请日：1999-03-30
IPC分类号： A46B1304
CPC分类号： H01L21/67051 , B08B1/04 , G05G1/08 , H01L21/67046 , Y10S134/902
摘要： A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.
摘要翻译： 擦洗洗涤装置包括：旋转卡盘，用于保持大致水平的待处理基板;喷嘴，用于将洗涤液供给到安装在旋转卡盘上的基板;水平移动支撑的支臂;设置在该臂上的输出轴; 直接或间接连接到输出轴的海绵刷，用于擦拭与其接触的旋转卡盘上的基底;压力机构，与输出轴一起向下移动海绵刷，用于将海绵刷压在旋转卡盘上的基底上 以及旋转驱动机构，其设置在所述按压机构的上方的旋转驱动机构能够与所述输出轴接合的位置，以通过与所述输出轴接合来直接旋转所述海绵刷。
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公开(公告)号：US06491760B2
公开(公告)日：2002-12-10
申请号：US09892090
申请日：2001-06-26
IPC分类号： B08B102
CPC分类号： H01L21/67051 , B08B1/04 , G05G1/08 , H01L21/67046 , Y10S134/902
摘要： A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.
摘要翻译： 擦洗洗涤装置包括：旋转卡盘，用于保持大致水平的待处理基板;喷嘴，用于将洗涤液供给到安装在旋转卡盘上的基板;水平移动支撑的支臂;设置在该臂上的输出轴; 直接或间接连接到输出轴的海绵刷，用于擦拭与其接触的旋转卡盘上的基底;压力机构，与输出轴一起向下移动海绵刷，用于将海绵刷压在旋转卡盘上的基底上 以及旋转驱动机构，其设置在所述按压机构的上方的旋转驱动机构能够与所述输出轴接合的位置，以通过与所述输出轴接合来直接旋转所述海绵刷。
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公开(公告)号：US06652662B1
公开(公告)日：2003-11-25
申请号：US09283920
申请日：1999-04-01
IPC分类号： B08B302
CPC分类号： H01L21/67253 , B08B1/00 , B08B1/04 , H01L21/67046 , Y10S134/902
摘要： A processing apparatus and a processing method are capable of properly and easily obtaining accurate data on the contact pressure applied by an end effector to a workpiece while a process is being carried out. A processing apparatus (7) processes a surface of a wafer (W) held by a spin chuck (22) (holding means) by bringing an end effector (40) into contact with the surface of the wafer (W). The end effector (40) can be retracted from the surface of the wafer (W) to a waiting position (25). A measuring and cleaning device (28) comprises, in combination, a measuring device (26) for measuring contact pressure to be applied to the wafer (W) by the end effector (40), and a cleaning device (27) for cleaning the end effector (40). The measuring device (26) has a table (60) for supporting the end effector (40), and a pressure sensor (62) for measuring a pressure applied to the table (60) to estimate a contact pressure actually applied by the end effector (40) to the wafer (W). The support surface of the table (60) and the surface of the wafer (W) held by the spin chuck (22) are on the same level.
摘要翻译： 处理装置和处理方法能够正确且容易地获得关于在执行处理时由端部执行器施加到工件的接触压力的准确数据。 处理装置（7）通过使端部执行器（40）与晶片（W）的表面接触来处理由旋转卡盘（22）（保持装置）保持的晶片（W）的表面。 末端执行器（40）可以从晶片（W）的表面缩回到等待位置（25）。 测量和清洁装置（28）组合包括用于测量由末端执行器（40）施加到晶片（W）的接触压力的测量装置（26）和用于清洁 末端执行器（40）。 测量装置（26）具有用于支撑端部执行器（40）的工作台（60）和用于测量施加到工作台（60）的压力的压力传感器（62），以估计由端部执行器 （40）到晶片（W）。 工作台（60）的支撑表面和由旋转卡盘（22）保持的晶片（W）的表面处于同一水平。
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公开(公告)号：US20120203010A1
公开(公告)日：2012-08-09
申请号：US13502834
申请日：2010-10-20
IPC分类号： C07D209/82
CPC分类号： C09K11/06 , C07D209/88 , C07D401/04 , C09K2211/1029 , H01L51/0072 , H01L51/5016 , H01L51/5056 , H01L51/5064 , H05B33/14
摘要： A carbazole compound represented by the following formula: wherein, when m=1, n=0, Ar1, Ar2, Ar3 and X2 are C6-50 aryl or C4-50 heteroaryl, provided that Ar1 and Ar2, or Ar3 and X2 may form together a ring; X1═C6-50 arylene; R1, R2, R4, R5 and R7 are H, halogen, amino, C1-18 alkyl, C1-18 alkoxy, C6-50 aryl or C4-50 heteroaryl, R3 and R6 are H, halogen, C1-18 alkyl, C1-18 alkoxy, C6-50 aryl or C4-50 heteroaryl; when m=0, n=1-3, Ar3, Ar4 and Ar5 are C6-50 aryl or C4-50 heteroaryl, Ar4 and Ar5 may form together a ring; X1═C1-18 alkyl, C6-50 aryl or C4-50 heteroaryl; X2═C6-50 arylene; R1-R7 are H, halogen, C1-18 alkyl, C1-18 alkoxy, C6-50 aryl or C4-50 heteroaryl; when m=0, n=0, X1═C1-18 alkyl, C6-50 aryl or C4-50 heteroaryl; Ar3 and X2 are C6-50 aryl or C4-50 heteroaryl; R2═H, halogen, C1-18 alkyl, C1-18 alkoxy; R1 and R3-R7 are H, halogen, C1-18 alkyl, C1-18 alkoxy, C6-50 aryl or C4-50 heteroaryl. The carbazole compound is suitable for an organic EL device.
摘要翻译： 由下式表示的咔唑化合物：其中当m = 1时n = 0，Ar 1，Ar 2，Ar 3和X 2为C 6-50芳基或C 4-50杂芳基，条件是Ar 1和Ar 2或Ar 3和X 2可以形成 一起一个戒指 X1 = C6-50亚芳基; R1，R2，R4，R5和R7是H，卤素，氨基，C1-18烷基，C1-18烷氧基，C6-50芳基或C4-50杂芳基，R3和R6是H，卤素，C1-18烷基，C1 -18烷氧基，C6-50芳基或C4-50杂芳基; 当m = 0时，n = 1-3，Ar 3，Ar 4和Ar 5为C 6-50芳基或C 4-50杂芳基，Ar 4和Ar 5可以一起形成环; X1 = C1-18烷基，C6-50芳基或C4-50杂芳基; X2 = C6-50亚芳基; R 1 -R 7是H，卤素，C 1-18烷基，C 1-18烷氧基，C 6-50芳基或C 4-50杂芳基; 当m = 0时，n = 0，X1 = C1-18烷基，C6-50芳基或C4-50杂芳基; Ar 3和X 2是C 6-50芳基或C 4-50杂芳基; R 2 = H，卤素，C 1-18烷基，C 1-18烷氧基; R1和R3-R7是H，卤素，C1-18烷基，C1-18烷氧基，C6-50芳基或C4-50杂芳基。 咔唑化合物适用于有机EL器件。
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公开(公告)号：US6115867A
公开(公告)日：2000-09-12
申请号：US135478
申请日：1998-08-17
IPC分类号： H01L21/304 , H01L21/00 , B08B7/04
CPC分类号： H01L21/67051 , H01L21/67046 , Y10S134/902
摘要： An apparatus for cleaning both sides of a substrate, incorporating a spin chuck for holding a substrate such that contact with at least a central portion of the substrate is prevented, a motor having a hollow shaft connected to the spin chuck to transmit rotating force to the spin chuck, a front-side cleaning mechanism for cleaning a surface of the substrate held by the spin chuck, and a back-side cleaning mechanism for rinsing a back side of the substrate held by the spin chuck, wherein the back-side cleaning mechanism is disposed to face the back side of the substrate held by the spin chuck through hollow portions of the hollow shaft.
摘要翻译： 一种用于清洁基板的两侧的装置，包括用于保持基板的旋转卡盘以防止与基板的至少中心部分的接触的马达，具有连接到旋转卡盘的中空轴的马达将旋转力传递到 旋转卡盘，用于清洁由旋转卡盘保持的基板的表面的前侧清洁机构和用于冲洗由旋转卡盘保持的基板的背面的背面清洁机构，其中后侧清洁机构 通过空心轴的中空部分设置成面对由旋转卡盘保持的基板的背面。
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公开(公告)号：US08344284B2
公开(公告)日：2013-01-01
申请号：US12665544
申请日：2008-07-23
申请人： Takanori Miyazaki , Masaru Kanaoka , Taira Ogita
发明人： Takanori Miyazaki , Masaru Kanaoka , Taira Ogita
CPC分类号： B23K26/1476 , B23K26/1488 , B23K26/38
摘要： A laser machining nozzle herein obtained includes a main assist-gas nozzle (2) for emitting a laser beam (8) and a main assist-gas, and an auxiliary assist-gas nozzle (5) annularly surrounding the main assist-gas nozzle for emitting an auxiliary assist-gas, whereby a gold plating (12) is provided on an interior surface of the main assist-gas nozzle to reflect the laser beam, so that a temperature rise of the laser machining nozzle can be prevented, and even when the laser beam (8) is reflected on the interior surface of the laser machining nozzle, it is possible to reduce peeling of the gold plating (12) applied onto the interior surface of the laser machining nozzle.
摘要翻译： 这里获得的激光加工喷嘴包括用于发射激光束（8）和主辅助气体的主辅助气体喷嘴（2）和环绕主辅助气体喷嘴的辅助辅助气体喷嘴（5），辅助辅助气体喷嘴 发出辅助辅助气体，由此在主辅助气体喷嘴的内表面上设置镀金（12）以反射激光束，从而可以防止激光加工喷嘴的温度上升，并且即使 激光束（8）在激光加工喷嘴的内表面上被反射，可以减少施加到激光加工喷嘴的内表面上的镀金（12）的剥离。
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8.发明申请公开(公告)号：US20110312247A1
公开(公告)日：2011-12-22
申请号：US13158600
申请日：2011-06-13
IPC分类号： B24B51/00
CPC分类号： B24B37/042
摘要： Provided are a rear substrate surface polishing device polishing a rear surface of a substrate, a rear substrate surface polishing system including the rear substrate surface polishing device, a rear substrate surface polishing method used in the rear substrate surface polishing device, and a storage medium for storing a program implemented with the rear substrate surface polishing method. In particular, the rear surface of the substrate is polished by a substrate polishing unit in accordance with information acquired from a prior process performed prior to the polishing process of the rear surface of the substrate at the substrate polishing unit. Further, the substrate polishing unit polishes the substrate with a polishing area determined on the basis of information acquired from a prior process. Furthermore, the polishing is performed by using any one or all of a plurality of substrate polishing units determined on the basis of information acquired from a prior process.
摘要翻译： 提供了研磨基板的背面的背面基板表面研磨装置，具有背面基板表面研磨装置的背面基板表面研磨系统，后方基板表面研磨装置所使用的背面基板表面研磨方法以及用于 存储利用后衬底表面抛光方法实现的程序。 特别地，基板抛光单元根据在基板抛光单元的基板的后表面的抛光处理之前执行的先前处理获得的信息来抛光基板的后表面。 此外，基板抛光单元用基于从先前处理获得的信息确定的抛光区域对基板进行抛光。 此外，通过使用基于从先前方法获取的信息确定的多个基板抛光单元中的任何一个或全部来进行抛光。
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9.发明授权公开(公告)号：US07803953B2
公开(公告)日：2010-09-28
申请号：US11806565
申请日：2007-06-01
IPC分类号： C07C209/10
CPC分类号： B01J31/24 , B01J2231/4283 , B01J2531/824 , C07C209/10 , C07C209/66 , C07C211/54
摘要： To provide a process for preparing an arylamine highly selectively and highly efficiently, which is also industrially superior without a fear of a side reaction when a strong base is employed. An aryl compound having an active group is reacted with an amine compound in the presence of a base by means of a catalyst for producing an arylamine which comprises a palladium compound having a tertiary phosphine group and a phase-transfer catalyst.
摘要翻译： 提供一种高选择性和高效制备芳基胺的方法，当使用强碱时，它也在工业上优于无副反应的担心。 具有活性基团的芳基化合物与胺化合物在碱的存在下通过用于制备包含具有叔膦基的钯化合物和相转移催化剂的芳基胺的催化剂进行反应。
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公开(公告)号：US20120160818A1
公开(公告)日：2012-06-28
申请号：US13393350
申请日：2011-05-24
申请人： Takanori Miyazaki , Norihiro Seto
发明人： Takanori Miyazaki , Norihiro Seto
IPC分类号： B23K26/38
CPC分类号： B23K26/18 , B23K26/38 , B23K26/40 , B23K2103/172
摘要： A laser machining apparatus includes an irradiating section and a control section. The control section causes, in a first period, the irradiating section to perform a first cutting process for cutting a workpiece in a region between a first region and a second region in such a manner that a state in which the first region is retained by the second region in the workpiece is kept, and causes, in a second period later than the first period, the irradiating section to perform a second cutting process for cutting the workpiece within the region between the first region and the second region in the workpiece, where a rear surface is exposed because a part of the protective sheet has been melted in the first cutting process, to separate the first region from the second region together with dross adhering to the rear surface in the first cutting process.
摘要翻译： 激光加工设备包括照射部分和控制部分。 所述控制部在第一期间使得所述照射部在所述第一区域和所述第二区域之间的区域中进行用于切割工件的第一切割处理，使得所述第一区域被所述第一区域保持的状态 保持工件中的第二区域，并且在比第一周期晚的第二时段中使得照射部分执行用于在工件中的第一区域和第二区域之间的区域内切割工件的第二切割处理，其中 由于保护片的一部分在第一切割工序中熔融而使第一区域与第二区域分离，并且在第一切割工序中，附着在附近的背面，也会露出后表面。
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