专利检索 ap:("Akira Nidan" OR "Takafumi Taki" OR "Hideaki Hara" OR "Michihiro Masuda" OR "Kaname Ban" OR "Kazuo Tanaka" OR "Yoshifumi Murakami") AND inv:"Kaname Ban" 第 1 页

1.

发明授权
Sensor held by base having lead 失效

公开(公告)号：US06591689B2

公开(公告)日：2003-07-15

申请号：US09894907

申请日：2001-06-29

申请人： Akira Nidan , Takafumi Taki , Hideaki Hara , Michihiro Masuda , Kaname Ban , Kazuo Tanaka , Yoshifumi Murakami

发明人： Akira Nidan , Takafumi Taki , Hideaki Hara , Michihiro Masuda , Kaname Ban , Kazuo Tanaka , Yoshifumi Murakami

IPC分类号： G01L916

CPC分类号： G01L19/0084 , G01L9/0054 , G01L19/147 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00

摘要： A pressure sensor has a sensor chip with a diaphragm formed therein and bumps formed thereon, and a stem with leads extending from a surface thereof to the sensor chip. The bumps and the leads are electrically connected by face down bonding so that a surface of the sensor chip faces the surface of the stem. In this manner, bonding wires are unnecessary. Therefore, an area for disposing the bonding wires in the stem can be cut down, so that the pressure sensor can be miniaturized.