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公开(公告)号：US06591689B2
公开(公告)日：2003-07-15
申请号：US09894907
申请日：2001-06-29
申请人： Akira Nidan , Takafumi Taki , Hideaki Hara , Michihiro Masuda , Kaname Ban , Kazuo Tanaka , Yoshifumi Murakami
发明人： Akira Nidan , Takafumi Taki , Hideaki Hara , Michihiro Masuda , Kaname Ban , Kazuo Tanaka , Yoshifumi Murakami
IPC分类号： G01L916
CPC分类号： G01L19/0084 , G01L9/0054 , G01L19/147 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor has a sensor chip with a diaphragm formed therein and bumps formed thereon, and a stem with leads extending from a surface thereof to the sensor chip. The bumps and the leads are electrically connected by face down bonding so that a surface of the sensor chip faces the surface of the stem. In this manner, bonding wires are unnecessary. Therefore, an area for disposing the bonding wires in the stem can be cut down, so that the pressure sensor can be miniaturized.
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2.发明申请Manufacturing device of semiconductor package and manufacturing method of semiconductor package 失效半导体封装制造装置及半导体封装的制造方法公开(公告)号：US20080090313A1
公开(公告)日：2008-04-17
申请号：US11882136
申请日：2007-07-31
CPC分类号： H01L24/81 , H01L22/20 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81121 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83908 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00014
摘要： A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiating an infrared light toward the substrate and monitoring an electrode pad under the second metal bump based on a reflected light reflected on the pad; and a determination element for determining a state of a bonding surface between the first and second metal bumps based on monitoring information of the pad. The monitoring element faces the bonding element through the holding element, the substrate and the package.
摘要翻译： 半导体封装的制造装置包括：用于保持基板的保持元件; 用于保持封装并将封装的第一金属凸块接合到衬底的第二金属凸块的接合元件; 监测元件，用于向基板照射红外光，并且基于在所述焊盘上反射的反射光来监测所述第二金属凸块下方的电极焊盘; 以及确定元件，用于基于所述焊盘的监视信息来确定所述第一和第二金属凸块之间的接合表面的状态。 监测元件通过保持元件，基板和封装件面向结合元件。
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公开(公告)号：US20080093740A1
公开(公告)日：2008-04-24
申请号：US11882135
申请日：2007-07-31
IPC分类号： H01L27/148
CPC分类号： G01P15/125 , B81B2201/0235 , B81C1/0023 , G01P1/023 , G01P15/0802 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2924/00014 , H01L2924/16195 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.
摘要翻译： 电容半导体传感器包括传感器芯片，电路芯片，多个凸块和多个虚拟凸块。 传感器芯片包括具有一个方向的检测轴的动态量检测器。 电路芯片包括信号处理电路。 传感器芯片和电路芯片通过多个凸块的倒装芯片接合来耦合。 此外，传感器芯片和电路芯片通过多个虚拟凸块机械耦合。
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公开(公告)号：US08156804B2
公开(公告)日：2012-04-17
申请号：US11882135
申请日：2007-07-31
IPC分类号： G01P1/02 , G01P15/125 , H01L29/00
CPC分类号： G01P15/125 , B81B2201/0235 , B81C1/0023 , G01P1/023 , G01P15/0802 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2924/00014 , H01L2924/16195 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.
摘要翻译： 电容半导体传感器包括传感器芯片，电路芯片，多个凸块和多个虚拟凸块。 传感器芯片包括具有一个方向的检测轴的动态量检测器。 电路芯片包括信号处理电路。 传感器芯片和电路芯片通过多个凸块的倒装芯片接合来耦合。 此外，传感器芯片和电路芯片通过多个虚拟凸块机械耦合。
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5.发明授权Manufacturing device of semiconductor package and manufacturing method of semiconductor package 失效半导体封装制造装置及半导体封装的制造方法公开(公告)号：US07659127B2
公开(公告)日：2010-02-09
申请号：US11882136
申请日：2007-07-31
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L22/20 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81121 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83908 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00014
摘要： A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiating an infrared light toward the substrate and monitoring an electrode pad under the second metal bump based on a reflected light reflected on the pad; and a determination element for determining a state of a bonding surface between the first and second metal bumps based on monitoring information of the pad. The monitoring element faces the bonding element through the holding element, the substrate and the package.
摘要翻译： 半导体封装的制造装置包括：用于保持基板的保持元件; 用于保持封装并将封装的第一金属凸块接合到衬底的第二金属凸块的接合元件; 监测元件，用于向基板照射红外光，并且基于在所述焊盘上反射的反射光来监测所述第二金属凸块下方的电极焊盘; 以及确定元件，用于基于所述焊盘的监视信息来确定所述第一和第二金属凸块之间的接合表面的状态。 监测元件通过保持元件，基板和封装件面向结合元件。
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