公开(公告)号：US07048434B2

公开(公告)日：2006-05-23

申请号：US10247048

申请日：2002-09-17

申请人： Alex Tregub ,  Mansour Moinpour ,  David Fryer

发明人： Alex Tregub ,  Mansour Moinpour ,  David Fryer

IPC分类号： G01N25/20

CPC分类号： G01N25/4846

摘要： Thermally analysis of layers and multiple layer structures used in the semiconductor processing arts is disclosed. A modulated calorimetric analysis may be used to determine a thermal signature that characterizes the chemical properties of a sample of material. The signature may include one or more thermal properties such as heat capacities. The signature may be used to compare and infer the suitability of a material for use in an integrated circuit manufacturing process. A thermal signature for a material that is not known to be suitable for manufacturing integrated circuits may be compared with a thermal signature for a standard material that is known to be suitable in order to determine whether the aforementioned material is suitable. Multiple layer structures may also be analyzed, compared, and inferred, and approaches for determining thermal signatures for any individual layer of the multiple layer structure are disclosed.

摘要翻译： 公开了半导体加工领域中使用的层和多层结构的热分析。 可以使用调制的量热分析来确定表征材料样品的化学性质的热特征。 签名可以包括一个或多个热性质，例如热容量。 签名可用于比较和推断用于集成电路制造过程中的材料的适用性。 可以将不知道适合于制造集成电路的材料的热学特征与已知适合于确定上述材料是否合适的标准材料的热学特征进行比较。 还可以分析，比较和推断多层结构，并且公开了用于确定多层结构的任何单独层的热特征的方法。