Integrating multiple thin film resistors
    1.
    发明授权
    Integrating multiple thin film resistors 有权
    集成多个薄膜电阻

    公开(公告)号:US06855585B1

    公开(公告)日:2005-02-15

    申请号:US10002429

    申请日:2001-10-31

    CPC分类号: H01L27/0802 H01L27/016

    摘要: A method for forming multiple resistors on a substrate. The method initially includes providing a first resistor on the substrate. A first dielectric layer is deposited, patterned, and selectively etched over the first resistor. Second resistor material is provided over the first dielectric layer. Furthermore, landing pad material is provided over the second resistor material. The landing pad material and the second resistor material are then selectively etched. The selective etching forms contacts for the first resistor in a first region, and forms a second resistor and associated contacts in a second region.

    摘要翻译: 一种在衬底上形成多个电阻器的方法。 该方法最初包括在衬底上提供第一电阻器。 在第一电阻器上沉积,图案化和选择性蚀刻第一电介质层。 第二电阻材料设置在第一介电层上。 此外,着陆垫材料设置在第二电阻材料上。 然后选择性地蚀刻着陆焊盘材料和第二电阻材料。 选择性蚀刻在第一区域中形成用于第一电阻器的触点,并且在第二区域中形成第二电阻器和相关联的触点。