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公开(公告)号:US20210170522A1
公开(公告)日:2021-06-10
申请号:US17182207
申请日:2021-02-22
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , B23K26/142 , B23K26/08 , A61C13/00 , B23K26/38 , B23K26/064
Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
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公开(公告)号:US20240066628A1
公开(公告)日:2024-02-29
申请号:US18506103
申请日:2023-11-09
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , A61C13/00 , B23K26/064 , B23K26/08 , B23K26/142 , B23K26/38 , G05B15/02
CPC classification number: B23K26/0626 , A61C13/0006 , B23K26/064 , B23K26/08 , B23K26/083 , B23K26/0853 , B23K26/0861 , B23K26/142 , B23K26/38 , G05B15/02 , A61C7/08
Abstract: Laser cutting systems and methods are described herein. Systems may include a laser, an optical component, a fixture for holding a dental appliance, and a controller. A cut path for trimming excess material from the dental appliance may be derived from a virtual cut path in a virtual version of the dental appliance. The excess material may be trimmed from the dental appliance along the cut path with the laser while adjusting a laser energy applied to the dental appliance to reduce a brittleness at an edge of the cut path. Adjusting the applied laser energy may include adjusting one or more of: a power of the laser, an optical component of the laser to adjust a focal length of the laser, and a relative orientation of the laser with respect to the dental appliance in at least three axes of movement.
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公开(公告)号:US20200338666A1
公开(公告)日:2020-10-29
申请号:US16924110
申请日:2020-07-08
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , B23K26/142 , B23K26/08 , A61C13/00 , B23K26/38 , B23K26/064
Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
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公开(公告)号:US20190337091A1
公开(公告)日:2019-11-07
申请号:US16512289
申请日:2019-07-15
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , B23K26/142 , B23K26/08 , B23K26/38 , A61C13/00 , B23K26/064
Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
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公开(公告)号:US20230129002A1
公开(公告)日:2023-04-27
申请号:US18088518
申请日:2022-12-23
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , B23K26/142 , B23K26/08 , A61C13/00 , G05B15/02 , B23K26/38 , B23K26/064
Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
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公开(公告)号:US20210154766A1
公开(公告)日:2021-05-27
申请号:US17167056
申请日:2021-02-03
Applicant: Align Technology, Inc.
Inventor: James C. CULP
IPC: B23K26/06 , B23K26/142 , B23K26/08 , A61C13/00 , B23K26/38 , B23K26/064
Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
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公开(公告)号:US20210001514A1
公开(公告)日:2021-01-07
申请号:US16983876
申请日:2020-08-03
Applicant: Align Technology, Inc.
Inventor: Yevgeniy SIROVSKIY , James C. CULP
Abstract: A method and system for thermal forming an object. A mold is provided, a shape of which corresponds to a desired shape of the object. A material is inserted into a heating area, and the material is heated using a plurality of independently controllable heat sources that heat different areas of the material. The heated material is then disposed over or into at least a portion of the mold so as to deform the material. The deformed material may then be trimmed so as to form the object.
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