公开(公告)号：US20240021565A1

公开(公告)日：2024-01-18

申请号：US18370150

申请日：2023-09-19

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo GULINO ,  Bogdan BANKIEWICZ ,  Oscar KHASELEV ,  Anna LIFTON ,  Michael T. MARCZI ,  Girard SIDONE ,  Paul SALERNO ,  Paul J. KOEP

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L2224/29111 ,  H01L2224/29411 ,  H01L2224/29347 ,  H01L2224/29013 ,  H01L2924/20755 ,  H01L2224/27849 ,  H01L2924/351 ,  H01L2924/014

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.