公开(公告)号：US20240351882A1

公开(公告)日：2024-10-24

申请号：US18664412

申请日：2024-05-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Ranjit PANDHER ,  Oscar KHASELEV

IPC: C01B32/19 ,  C25B1/00 ,  C25B9/00

CPC classification number: C01B32/19 ,  C25B1/00 ,  C25B9/00

Abstract: A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the number of layers. Fewer defects are found in the end graphene product in comparison to previous methods. The inventive method of producing graphene is less aggressive, lower cost and more environmentally friendly than previous methods. This method is applicable to both laboratory scale and high volume manufacturing for producing high quality graphene flakes.

公开(公告)号：US20240021565A1

公开(公告)日：2024-01-18

申请号：US18370150

申请日：2023-09-19

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo GULINO ,  Bogdan BANKIEWICZ ,  Oscar KHASELEV ,  Anna LIFTON ,  Michael T. MARCZI ,  Girard SIDONE ,  Paul SALERNO ,  Paul J. KOEP

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L2224/29111 ,  H01L2224/29411 ,  H01L2224/29347 ,  H01L2224/29013 ,  H01L2924/20755 ,  H01L2224/27849 ,  H01L2924/351 ,  H01L2924/014

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

公开(公告)号：US20220371089A1

公开(公告)日：2022-11-24

申请号：US17754125

申请日：2020-09-24

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Remya CHANDRAN ,  Manoharan VENODH ,  Bawa SINGH ,  Barun DAS ,  Niveditha NAGARAJAN ,  Rahul RAUT ,  Oscar KHASELEV ,  Ranjit PANDHER ,  Supriya DEVARAJAN ,  Anubhav RUSTOGI

IPC: B22F7/04 ,  B22F1/107 ,  B22F9/30 ,  H05K1/09 ,  H05K3/12 ,  H01B13/012 ,  H05K3/34 ,  H01L23/00 ,  H01B1/02 ,  B23K35/30

Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

公开(公告)号：US20220241852A1

公开(公告)日：2022-08-04

申请号：US17594978

申请日：2020-05-05

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar KHASELEV ,  Matthew James SIEBENHUHNER ,  Monnir BOUREGHDA ,  Mike MARCZI ,  Carl BILGRIEN

IPC: B22D21/06 ,  B23K1/00 ,  B22D25/04 ,  B22C9/22

Abstract: A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define the designed openings (5). The backing layer (4) may be configured for sealing a bottom of the designed openings (5), wherein at the start of step b), a top of the designed openings (5) may be open for receiving the cast silver film layer (7).