公开(公告)号：US09802275B2

公开(公告)日：2017-10-31

申请号：US15109352

申请日：2014-12-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Rahul Raut ,  Traian Cornel Cucu ,  Shu Tai Yong ,  Siuli Sarkar ,  Ramakrishna Hosur Katagiriyappa

IPC: H05K1/09 ,  B23K35/362 ,  B23K35/26 ,  B23K35/36 ,  B23K35/02 ,  H05K1/11 ,  H05K9/00

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.