公开(公告)号：US08796789B2

公开(公告)日：2014-08-05

申请号：US13744951

申请日：2013-01-18

申请人： Alps Electric Co., Ltd.

发明人： Yoshitaka Uto ,  Akira Miyatake ,  Toru Takahashi ,  Toshihiro Kobayashi ,  Chiaki Kera ,  Hisayuki Yazawa ,  Hisanobu Okawa

IPC分类号： H01L27/14

CPC分类号： H01L23/10 ,  B81B2207/07 ,  B81C1/00269 ,  B81C2203/019 ,  B81C2203/035 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A first sealing layer having a frame-like shape and a first contact layer are formed on a back surface of a frame portion of a sensor substrate. The first contact layer is separated from the first sealing layer, extends through a functional member and an insulation layer, and is electrically connected to the functional member and a first base member. A second sealing layer and a second contact layer are formed on a surface of a wiring substrate. The second sealing layer faces the first sealing layer. The second contact layer is separated from the second sealing layer, extends through the insulation layer, and is electrically connected to the second base member. The sealing layers are eutectically bonded to each other. The contact layers are electrically connected to each other, and thereby the first and second base members and the frame portion have the same potential.

摘要翻译： 在传感器基板的框架部分的后表面上形成具有框状形状的第一密封层和第一接触层。 第一接触层与第一密封层分离，延伸通过功能部件和绝缘层，并且电连接到功能部件和第一基体部件。 在布线基板的表面上形成第二密封层和第二接触层。 第二密封层面向第一密封层。 第二接触层与第二密封层分离，延伸穿过绝缘层，并与第二基底部件电连接。 密封层彼此共晶结合。 接触层彼此电连接，从而第一和第二基底构件和框架部分具有相同的电位。