公开(公告)号：US20240336474A1

公开(公告)日：2024-10-10

申请号：US18298311

申请日：2023-04-10

申请人： AAC Technologies Pte. Ltd.

发明人： Houming Chong ,  Veronica Tan ,  Zaixiang Pua ,  Kahkeen Lai ,  Zhan Zhan

IPC分类号： B81B3/00 ,  B81C1/00 ,  G01C19/5733 ,  G01C19/5769

CPC分类号： B81B3/0037 ,  B81C1/00166 ,  G01C19/5733 ,  G01C19/5769 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/04 ,  B81C2201/0105 ,  B81C2201/0132 ,  B81C2203/0109

摘要： A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.

公开(公告)号：US20240159534A1

公开(公告)日：2024-05-16

申请号：US18506424

申请日：2023-11-10

申请人： SEIKO EPSON CORPORATION

发明人： Masataka KAZUNO ,  Kenji YAMAMOTO

IPC分类号： G01C19/5733 ,  H03H9/05 ,  H03H9/10 ,  H03H9/215

CPC分类号： G01C19/5733 ,  H03H9/0542 ,  H03H9/0552 ,  H03H9/105 ,  H03H9/215

摘要： An electronic device includes a substrate, a first electronic component mounted on the substrate and including a first vibrator element vibrating along a first plane along the substrate, a second electronic component mounted on the substrate and including a second vibrator element vibrating along a second plane crossing the first plane, a third electronic component mounted on the substrate and including a third vibrator element vibrating along a third plane crossing the first plane and the second plane, and a cap mounted on the substrate and covering the first electronic component, the second electronic component, and the third electronic component, wherein a resonance mode of the cap is not within vibration frequency bands of the second vibrator element and the third vibrator element in an operation temperature range.

公开(公告)号：US20240133691A1

公开(公告)日：2024-04-25

申请号：US18546396

申请日：2022-03-03

申请人： OFFICE NATIONAL D'ETUDES ET DE RECHERCHES AÉROSPATIALES

发明人： Olivier LE TRAON ,  Raphaël LEVY ,  Jean GUERARD ,  Thomas PERRIER

IPC分类号： G01C19/5733 ,  G01L1/16 ,  G01L5/04

CPC分类号： G01C19/5733 ,  G01L1/162 ,  G01L5/042

摘要： A resonator is suitable for reducing or suppressing a force transmitted by a vibrating portion of the resonator to a support part. To this end, the vibrating portion includes two extensions which are each meander shaped such that two segments of each extension have respective speed components that are oriented in opposite directions. Such a resonator, which is balanced, can advantageously be used within a rate gyro or a force sensor.

公开(公告)号：US20240019248A1

公开(公告)日：2024-01-18

申请号：US18175238

申请日：2023-02-27

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Hiroki HIRAGA ,  Yasushi TOMIZAWA ,  Kengo UCHIDA ,  Kei MASUNISHI ,  Fumito MIYAZAKI ,  Ryunosuke GANDO ,  Shiori KAJI ,  Etsuji OGAWA ,  Daiki ONO

IPC分类号： G01C19/5769 ,  G01C19/5733

CPC分类号： G01C19/5769 ,  G01C19/5733

摘要： According to one embodiment, a sensor includes a base body including a first face, a first support portion, a first movable portion, and a first insulating member. The first face includes a first base region, a second base region, and a third base region. The first support portion is fixed to the third base region. The first movable portion is supported by the first support portion. The first movable portion includes a first movable region and a second movable region. A first gap is provided between the first base region and the first movable region. The first insulating member is fixed to the second base region, and located between the second base region and the second movable region in a first direction from the third base region to the first support portion. A second gap is provided between the first insulating member and the second movable region.

公开(公告)号：US11867509B2

公开(公告)日：2024-01-09

申请号：US17679497

申请日：2022-02-24

申请人： INVENSENSE, INC.

发明人： Damiano Milani ,  Luca Coronato

IPC分类号： G01C19/5762 ,  G01C19/5712 ,  B81B3/00 ,  G01C19/5733 ,  G01C19/5769 ,  G01C19/5726

CPC分类号： G01C19/5762 ,  B81B3/0021 ,  G01C19/5712 ,  G01C19/5726 ,  G01C19/5733 ,  G01C19/5769 ,  B81B2201/0242 ,  B81B2203/0163 ,  B81B2203/04 ,  B81B2207/012

摘要： A MEMS gyroscope includes a driven mass that moves in response to a drive force. A drive amplitude sense electrode is included as a feature of the drive mass and extends in a direction perpendicular to the drive direction. A change in capacitance is measured based on the relative location of the drive amplitude sense electrode to a known fixed position, which in turn is used to accurately determine a location of the driven mass.

公开(公告)号：US20190212144A1

公开(公告)日：2019-07-11

申请号：US15868746

申请日：2018-01-11

申请人： InvenSense, Inc.

发明人： Matthew Thompson

IPC分类号： G01C19/56 ,  B81B3/00

CPC分类号： G01C19/56 ,  B81B3/0018 ,  B81B2201/0228 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5733 ,  G01C19/574 ,  G01P15/125

摘要： A microelectromechanical (MEMS) sensor comprises MEMS components located within a MEMS layer and located relative to one or more electrodes. A plurality of proof masses are located within the MEMS layer and are not electrically coupled to each other within the MEMS layer. Both the first proof mass and the second proof mass move relative to at least a common electrode of the one or more electrodes, such that the relative position of each of the proof masses relative to the electrode may be sensed. A sensed parameter may be determined based on the sensed relative positions.

公开(公告)号：US20180306581A1

公开(公告)日：2018-10-25

申请号：US15948174

申请日：2018-04-09

申请人： Seiko Epson Corporation

发明人： Makoto FURUHATA ,  Kei KANEMOTO

IPC分类号： G01C19/5733 ,  G01P3/22 ,  G01C19/5769 ,  B60W30/02 ,  B60W10/184 ,  B60W10/22

CPC分类号： G01C19/5733 ,  B60W10/184 ,  B60W10/22 ,  B60W30/02 ,  B60W2420/10 ,  B81B3/0051 ,  B81B3/0078 ,  B81B2201/0242 ,  G01C19/574 ,  G01C19/5769 ,  G01P3/22

摘要： A physical quantity sensor includes a driven section and a drive spring that supports the driven section so that the driven section is displaceable in a first direction. The drive spring has a serpentine shape and includes a plurality of spring structures extending in a second direction that intersects a first direction. At least one of the spring structures has a thin section that is thinner in a third direction that intersects the first and second directions than the other portions of the drive spring.

公开(公告)号：US20180180419A1

公开(公告)日：2018-06-28

申请号：US15286348

申请日：2016-10-05

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Aaron A. Geisberger

IPC分类号： G01C19/5747 ,  G01C19/5712 ,  G01C19/5769

CPC分类号： G01C19/5747 ,  G01C19/5712 ,  G01C19/5733 ,  G01C19/5769

摘要： An inertial sensor includes a substrate, a movable mass, and a motion limit structure. The motion limit structure includes a rigid element interposed between first and second spring beams. The first spring beam has a first end fixed with the substrate and a second end coupled with the rigid element. The second spring beam is located between a pair of beams extending from an edge of the movable mass and is separated from each of the beams by a gap. The second spring beam has a third beam end coupled with the movable mass and a fourth beam end coupled with the rigid element. When the movable mass is stimulated to move beyond a predetermined limit, the rigid beam pivots as the spring beams flex. The second spring beam flexes to close the gap and contact one of the pair of beams to limit motion of the movable mass.

公开(公告)号：US20170271446A1

公开(公告)日：2017-09-21

申请号：US15457833

申请日：2017-03-13

申请人： Infineon Technologies AG

发明人： Ravi Keshav Joshi ,  Johannes Baumgartl ,  Oliver Blank ,  Oliver Hellmund ,  Martin Poelzl

IPC分类号： H01L29/06 ,  H01L29/08 ,  H01L21/78 ,  H01L29/78 ,  B81B7/00 ,  B81C1/00 ,  H01L29/40 ,  H01L29/10 ,  H01L21/683

CPC分类号： H01L29/0696 ,  B81B3/0072 ,  B81B7/008 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0707 ,  G01C19/5733 ,  G01P15/125 ,  H01L21/6835 ,  H01L21/78 ,  H01L29/02 ,  H01L29/0649 ,  H01L29/0834 ,  H01L29/0865 ,  H01L29/1095 ,  H01L29/404 ,  H01L29/407 ,  H01L29/41766 ,  H01L29/66348 ,  H01L29/66734 ,  H01L29/7391 ,  H01L29/7397 ,  H01L29/78 ,  H01L29/7811 ,  H01L29/7813 ,  H01L2221/68327

摘要： First reinforcement stripes are formed on a process surface of a base substrate. A first epitaxial layer covering the first reinforcement stripes is formed on the first process surface. Second reinforcement stripes are formed on the first epitaxial layer. A second epitaxial layer covering the second reinforcement stripes is formed on exposed portions of the first epitaxial layer. Semiconducting portions of transistor cells are formed in or portions of micro electromechanical structures are formed from the second epitaxial layer.

公开(公告)号：US20170268880A1

公开(公告)日：2017-09-21

申请号：US15610251

申请日：2017-05-31

申请人： STMICROELECTRONICS S.r.l.

发明人： Luca Giuseppe Falorni ,  Carlo Valzasina ,  Roberto Carminati ,  Alessandro Tocchio

IPC分类号： G01C19/5712 ,  G01C19/5733 ,  B81B3/00 ,  G01C19/5747

CPC分类号： G01C19/5712 ,  B81B3/0018 ,  B81B3/0086 ,  B81B2201/025 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747

摘要： MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.