公开(公告)号：US12222776B1

公开(公告)日：2025-02-11

申请号：US17547919

申请日：2021-12-10

Applicant: Amazon Technologies, Inc.

Inventor： Ali Elashri ,  William Mark Megarity ,  Ryan F Conroy ,  Chetan Sanjay Agarwal ,  Priti Choudhary

IPC: G06F1/18 ,  G06F1/20 ,  H05K7/20

Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.