公开(公告)号：US20230066170A1

公开(公告)日：2023-03-02

申请号：US18045100

申请日：2022-10-07

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  Brendan Cully ,  William Mark Megarity ,  Ryan F. Conroy ,  Andrew Kent Warfield ,  Priti Choudhary

IPC: G06F1/18

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

公开(公告)号：US11910566B1

公开(公告)日：2024-02-20

申请号：US17206023

申请日：2021-03-18

Applicant: Amazon Technologies, Inc.

Inventor： Luke Thomas Gregory ,  Darin Lee Frink ,  Rick Chun Kit Cheung ,  Nafea Bshara ,  Kenny Kiet Huynh ,  Noah Kelly ,  Priti Choudhary ,  Ali Elashri

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H05K7/20281 ,  H05K7/2039 ,  H05K7/20263

Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.

公开(公告)号：US12222776B1

公开(公告)日：2025-02-11

申请号：US17547919

申请日：2021-12-10

Applicant: Amazon Technologies, Inc.

Inventor： Ali Elashri ,  William Mark Megarity ,  Ryan F Conroy ,  Chetan Sanjay Agarwal ,  Priti Choudhary

IPC: G06F1/18 ,  G06F1/20 ,  H05K7/20

Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.

公开(公告)号：US11594261B1

公开(公告)日：2023-02-28

申请号：US17203635

申请日：2021-03-16

Applicant: Amazon Technologies, Inc.

Inventor： Rick Chun Kit Cheung ,  Luke Thomas Gregory ,  Priti Choudhary ,  Brandyn Giroux

IPC: G11B33/14 ,  G11B5/008 ,  G11B15/68

Abstract: A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.

公开(公告)号：US11523533B1

公开(公告)日：2022-12-06

申请号：US17008839

申请日：2020-09-01

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  William Mark Megarity ,  Priti Choudhary

IPC: G08B5/36 ,  G08B21/24 ,  G06F11/30 ,  G11B33/10 ,  H05K7/14 ,  G09G3/14 ,  H05K7/20

Abstract: Systems and techniques for tracking and providing real-time visualizations of maintenance time for datacenter components. The systems include sensors to detect when datacenter components are opened for maintenance, such as hot switching of hard drive disks, to initialize a countdown timer. Status indicator lights of components within the datacenter component are used to display visual representations of the countdown timer. The visualizations present a remaining or elapsed maintenance time remaining to ensure components of the datacenter component are not damaged by overheating during maintenance.

公开(公告)号：US11467636B1

公开(公告)日：2022-10-11

申请号：US17037520

申请日：2020-09-29

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  Brendan Cully ,  William Mark Megarity ,  Ryan F Conroy ,  Andrew Kent Warfield ,  Priti Choudhary

IPC: G06F1/18

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.