公开(公告)号：US11897761B2

公开(公告)日：2024-02-13

申请号：US17832904

申请日：2022-06-06

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ki Yeul Yang ,  Kyung Han Ryu ,  Seok Hun Yun ,  Bora Baloglu ,  Hyun Cho ,  Ramakanth Alapati

IPC分类号： B81C1/00 ,  H01L23/48 ,  B81B7/00

CPC分类号： B81C1/00182 ,  B81B7/007 ,  B81C1/00158 ,  B81C1/00301 ,  H01L23/481 ,  B81B2201/02

摘要： In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.