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1.发明公开公开(公告)号：US20240274445A1
公开(公告)日：2024-08-15
申请号：US18587291
申请日：2024-02-26
发明人： Bora Baloglu , Suresh Jayaraman , Ronald Huemoeller , Andre Cardoso , Eoin O'Toole , Marta Sa Santos , Luis Alves , Jose Moreira da Silva , Fernando Teixeira , Jose Luis Silva
IPC分类号： H01L21/67 , H01L21/56 , H01L21/683
CPC分类号： H01L21/67092 , H01L21/561 , H01L21/568 , H01L21/6836
摘要： A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.
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2.发明授权公开(公告)号：US11915949B2
公开(公告)日：2024-02-27
申请号：US17176039
申请日：2021-02-15
发明人： Bora Baloglu , Suresh Jayaraman , Ronald Huemoeller , Andre Cardoso , Eoin O'Toole , Marta Sa Santos , Luis Alves , Jose Moreira da Silva , Fernando Teixeira , Jose Luis Silva
IPC分类号： H01L21/67 , H01L21/56 , H01L21/683
CPC分类号： H01L21/67092 , H01L21/561 , H01L21/568 , H01L21/6836
摘要： A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.
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公开(公告)号：US11897761B2
公开(公告)日：2024-02-13
申请号：US17832904
申请日：2022-06-06
发明人： Ki Yeul Yang , Kyung Han Ryu , Seok Hun Yun , Bora Baloglu , Hyun Cho , Ramakanth Alapati
CPC分类号： B81C1/00182 , B81B7/007 , B81C1/00158 , B81C1/00301 , H01L23/481 , B81B2201/02
摘要： In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
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4.发明申请公开(公告)号：US20210265182A1
公开(公告)日：2021-08-26
申请号：US17176039
申请日：2021-02-15
发明人： Bora Baloglu , Suresh Jayaraman , Ronald Huemoeller , Andre Cardoso , Eoin O'Toole , Marta Sa Santos , Luis Alves , Jose Moreira da Silva , Fernando Teixeira , Jose Luis Silva
摘要： A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.
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5.发明授权公开(公告)号：US12015000B2
公开(公告)日：2024-06-18
申请号：US17328563
申请日：2021-05-24
发明人： Bora Baloglu , Curtis Zwenger , Ron Huemoeller
IPC分类号： H01L21/00 , H01L23/00 , H01L25/00 , H01L25/10 , H01L25/065
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L25/0657 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/0508 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05558 , H01L2224/05572 , H01L2224/05573 , H01L2224/05575 , H01L2224/0558 , H01L2224/05582 , H01L2224/05583 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/1147 , H01L2224/13018 , H01L2224/13147 , H01L2224/13155 , H01L2224/1405 , H01L2224/16055 , H01L2224/16145 , H01L2224/16148 , H01L2224/16238 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/80203 , H01L2224/81005 , H01L2224/81141 , H01L2224/81203 , H01L2224/8134 , H01L2224/81385 , H01L2224/81898 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2224/94 , H01L2224/81 , H01L2224/94 , H01L2224/11 , H01L2224/05666 , H01L2924/01028 , H01L2924/013 , H01L2924/00014 , H01L2224/05666 , H01L2924/01074 , H01L2924/013 , H01L2924/00014 , H01L2224/97 , H01L2224/81 , H01L2224/05147 , H01L2924/00014 , H01L2924/013 , H01L2224/05124 , H01L2924/00014 , H01L2924/013 , H01L2224/05139 , H01L2924/00014 , H01L2924/013 , H01L2224/05144 , H01L2924/00014 , H01L2924/013 , H01L2224/05155 , H01L2924/00014 , H01L2924/013 , H01L2224/13147 , H01L2924/00014 , H01L2924/013 , H01L2224/13155 , H01L2924/00014 , H01L2224/05666 , H01L2924/00014 , H01L2924/013 , H01L2224/05671 , H01L2924/00014 , H01L2924/013 , H01L2224/05647 , H01L2924/00014 , H01L2924/013 , H01L2224/05666 , H01L2924/00014 , H01L2924/01028 , H01L2924/013 , H01L2224/05666 , H01L2924/00014 , H01L2924/01074 , H01L2924/013
摘要： A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
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公开(公告)号：US11823913B2
公开(公告)日：2023-11-21
申请号：US17340776
申请日：2021-06-07
发明人： Bora Baloglu , Curtis Zwenger , Ronald Huemoeller
IPC分类号： H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L21/568 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L24/13 , H01L24/16 , H01L2221/68359 , H01L2221/68377 , H01L2224/12105 , H01L2224/131 , H01L2224/1319 , H01L2224/13147 , H01L2224/16227 , H01L2224/81002 , H01L2224/81005 , H01L2224/81203 , H01L2224/81815 , H01L2224/83005 , H01L2224/83102 , H01L2224/9202 , H01L2224/9211 , H01L2224/92125 , H01L2224/96 , H01L2224/97 , H01L2924/181 , H01L2924/18161 , H01L2224/97 , H01L2224/81 , H01L2224/131 , H01L2924/014 , H01L2224/13147 , H01L2924/00014 , H01L2224/96 , H01L2224/19 , H01L2224/1319 , H01L2924/0781 , H01L2224/81203 , H01L2924/00014 , H01L2224/83102 , H01L2924/00014 , H01L2224/9211 , H01L2224/81 , H01L2224/83
摘要： An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.
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公开(公告)号：US11784101B2
公开(公告)日：2023-10-10
申请号：US16806927
申请日：2020-03-02
发明人： Shaun Bowers , Bora Baloglu
IPC分类号： H01L23/053 , H01L23/10 , H01L23/498 , H01L21/48 , H01L21/52
CPC分类号： H01L23/053 , H01L21/486 , H01L21/4817 , H01L21/4853 , H01L21/52 , H01L23/10 , H01L23/49816 , H01L23/49827
摘要： In one example, a semiconductor device comprises a substrate comprising a conductive structure, an electronic component over a top side of the substrate and electrically coupled with the conductive structure, a lid structure over the substrate and over the electronic component, and a vertical interconnect in the lid structure extending to a top surface of the lid structure and electrically coupled with the conductive structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20210272862A1
公开(公告)日：2021-09-02
申请号：US16806927
申请日：2020-03-02
发明人： Shaun Bowers , Bora Baloglu
IPC分类号： H01L23/053 , H01L23/10 , H01L23/498 , H01L21/52 , H01L21/48
摘要： In one example, a semiconductor device comprises a substrate comprising a conductive structure, an electronic component over a top side of the substrate and electrically coupled with the conductive structure, a lid structure over the substrate and over the electronic component, and a vertical interconnect in the lid structure extending to a top surface of the lid structure and electrically coupled with the conductive structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US11444013B2
公开(公告)日：2022-09-13
申请号：US16707145
申请日：2019-12-09
发明人： Bora Baloglu , Ron Huemoeller , Curtis Zwenger
IPC分类号： H01L23/498 , H01L23/00 , H01L23/16 , H01L21/56 , H01L21/48 , H01L21/78 , H01L23/18 , H01L23/31
摘要： An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.
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10.发明申请公开(公告)号：US20210280542A1
公开(公告)日：2021-09-09
申请号：US17328563
申请日：2021-05-24
发明人： Bora Baloglu , Curtis Zwenger , Ron Huemoeller
摘要： A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
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