公开(公告)号：US20160130139A1

公开(公告)日：2016-05-12

申请号：US14534663

申请日：2014-11-06

Applicant: Analog Devices, Inc.

Inventor： Jeffrey A. Gregory ,  See-Ho Tsang

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/097 ,  B81C1/00095 ,  B81C2203/0109 ,  B81C2203/0118

Abstract: The cap wafer for a MEMS device includes multiple electrically isolated electrodes that can be bonded and electrically connected to separate electrical contacts on a MEMS device wafer. The electrically isolated electrodes can be used for any of a variety of functions, such as for apply a force to a movable MEMS structure on the MEMS device wafer (e.g., for driving resonance of the movable MEMS structure or for adjusting a resonance or sense mode of the movable MEMS structure) or for sensing motion of a movable MEMS structure on the MEMS device wafer. Since the electrodes are electrically isolated, different electrodes may be used for different functions.

Abstract translation: 用于MEMS器件的盖晶片包括多个电隔离电极，其可以结合并电连接到MEMS器件晶片上的分离的电触点。 电隔离电极可以用于各种功能中的任何一种，例如用于向MEMS器件晶片上的可移动MEMS结构施加力（例如，用于驱动可移动MEMS结构的谐振或用于调整谐振或感测模式 的可移动MEMS结构）或用于感测MEMS装置晶片上的可移动MEMS结构的运动。 由于电极是电隔离的，所以不同的电极可以用于不同的功能。

公开(公告)号：US20170174504A1

公开(公告)日：2017-06-22

申请号：US15450797

申请日：2017-03-06

Applicant: Analog Devices, Inc.

Inventor： Jeffrey A. Gregory ,  See-Ho Tsang

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/097 ,  B81C1/00095 ,  B81C2203/0109 ,  B81C2203/0118

Abstract: The cap wafer for a MEMS device includes multiple electrically isolated electrodes that can be bonded and electrically connected to separate electrical contacts on a MEMS device wafer. The electrically isolated electrodes can be used for any of a variety of functions, such as for apply a force to a movable MEMS structure on the MEMS device wafer (e.g., for driving resonance of the movable MEMS structure or for adjusting a resonance or sense mode of the movable MEMS structure) or for sensing motion of a movable MEMS structure on the MEMS device wafer. Since the electrodes are electrically isolated, different electrodes may be used for different functions.

公开(公告)号：US10087070B2

公开(公告)日：2018-10-02

申请号：US15450797

申请日：2017-03-06

Applicant: Analog Devices, Inc.

Inventor： Jeffrey A. Gregory ,  See-Ho Tsang

IPC: B81B7/02 ,  B81C1/00 ,  B81B7/00

Abstract: The cap wafer for a MEMS device includes multiple electrically isolated electrodes that can be bonded and electrically connected to separate electrical contacts on a MEMS device wafer. The electrically isolated electrodes can be used for any of a variety of functions, such as for apply a force to a movable MEMS structure on the MEMS device wafer (e.g., for driving resonance of the movable MEMS structure or for adjusting a resonance or sense mode of the movable MEMS structure) or for sensing motion of a movable MEMS structure on the MEMS device wafer. Since the electrodes are electrically isolated, different electrodes may be used for different functions.

公开(公告)号：US09604841B2

公开(公告)日：2017-03-28

申请号：US14534663

申请日：2014-11-06

Applicant: Analog Devices, Inc.

Inventor： Jeffrey A. Gregory ,  See-Ho Tsang

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/097 ,  B81C1/00095 ,  B81C2203/0109 ,  B81C2203/0118

Abstract: The cap wafer for a MEMS device includes multiple electrically isolated electrodes that can be bonded and electrically connected to separate electrical contacts on a MEMS device wafer. The electrically isolated electrodes can be used for any of a variety of functions, such as for apply a force to a movable MEMS structure on the MEMS device wafer (e.g., for driving resonance of the movable MEMS structure or for adjusting a resonance or sense mode of the movable MEMS structure) or for sensing motion of a movable MEMS structure on the MEMS device wafer. Since the electrodes are electrically isolated, different electrodes may be used for different functions.