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公开(公告)号：US11726220B2
公开(公告)日：2023-08-15
申请号：US17152530
申请日：2021-01-19
Applicant: Analogic Corporation
Inventor： Lane Marsden
CPC classification number: G01T1/2985 , A61B6/03 , A61B6/4488 , G01T1/2018
Abstract: A radiation scanning system comprises a radiation detector configured to measure at least some radiation. The radiation detector comprises an arc portion exhibiting a semicircular shape, the arc portion comprising a plurality of facets on a side thereof, a detector module coupled to each facet, the detector module comprising a base portion comprising a first substantially planar surface in contact with the facet, a detector unit coupled to a second substantially planar surface of the base portion, the second substantially planar surface parallel with the first substantially planar surface, and a cooling structure in thermal communication with a side of the arc portion opposite the plurality of facets. Related radiation detectors and radiation systems are also disclosed.
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公开(公告)号：US20190235099A1
公开(公告)日：2019-08-01
申请号：US16378168
申请日：2019-04-08
Applicant: Analogic Corporation
Inventor： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher David Tibbetts
Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.
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公开(公告)号：US20240061131A1
公开(公告)日：2024-02-22
申请号：US18458033
申请日：2023-08-29
Applicant: Analogic Corporation
Inventor： Lane Marsden , Randy Luhta
IPC: G01T1/20 , H01L27/146 , G01T7/00
CPC classification number: G01T1/20188 , H01L27/14623 , H01L27/14661 , G01T7/00 , H01L27/14685 , H01L27/1469 , H01L27/14663
Abstract: A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.
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公开(公告)号：US10802166B2
公开(公告)日：2020-10-13
申请号：US16378168
申请日：2019-04-08
Applicant: Analogic Corporation
Inventor： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher David Tibbetts
IPC: G01T1/20 , G01T7/00 , H05K1/02 , H01L27/146
Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.
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公开(公告)号：US10254421B2
公开(公告)日：2019-04-09
申请号：US15566252
申请日：2015-09-18
Applicant: ANALOGIC CORPORATION
Inventor： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher Tibbetts
IPC: G01T1/20 , G01T7/00 , H01L27/146
Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.
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Patent Agency Ranking
公开(公告)号：US12298451B2
公开(公告)日：2025-05-13
申请号：US18458033
申请日：2023-08-29
Applicant: Analogic Corporation
Inventor： Lane Marsden , Randy Luhta
IPC: G01T1/20 , G01T7/00 , H01L27/146
Abstract: A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.
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公开(公告)号：US11740367B2
公开(公告)日：2023-08-29
申请号：US17571262
申请日：2022-01-07
Applicant: Analogic Corporation
Inventor： Lane Marsden , Randy Luhta
IPC: G01T1/20 , H01L27/146 , G01T7/00
CPC classification number: G01T1/20188 , G01T7/00 , H01L27/1469 , H01L27/14623 , H01L27/14661 , H01L27/14663 , H01L27/14685
Abstract: A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.
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公开(公告)号：US20230221452A1
公开(公告)日：2023-07-13
申请号：US17571262
申请日：2022-01-07
Applicant: Analogic Corporation
Inventor： Lane Marsden , Randy Luhta
IPC: G01T1/20 , H01L27/146 , G01T7/00
CPC classification number: G01T1/20188 , H01L27/14623 , H01L27/14661 , H01L27/14663 , H01L27/14685 , H01L27/1469 , G01T7/00
Abstract: A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.
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公开(公告)号：US20220229195A1
公开(公告)日：2022-07-21
申请号：US17152530
申请日：2021-01-19
Applicant: Analogic Corporation
Inventor： Lane Marsden
Abstract: A radiation scanning system comprises a radiation detector configured to measure at least some radiation. The radiation detector comprises an arc portion exhibiting a semicircular shape, the arc portion comprising a plurality of facets on a side thereof, a detector module coupled to each facet, the detector module comprising a base portion comprising a first substantially planar surface in contact with the facet, a detector unit coupled to a second substantially planar surface of the base portion, the second substantially planar surface parallel with the first substantially planar surface, and a cooling structure in thermal communication with a side of the arc portion opposite the plurality of facets. Related radiation detectors and radiation systems are also disclosed.
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公开(公告)号：US11275187B2
公开(公告)日：2022-03-15
申请号：US17008889
申请日：2020-09-01
Applicant: Analogic Corporation
Inventor： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher David Tibbetts
IPC: G01T1/20 , G01T7/00 , H05K1/02 , H01L27/146
Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.
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