公开(公告)号：US20190235099A1

公开(公告)日：2019-08-01

申请号：US16378168

申请日：2019-04-08

Applicant: Analogic Corporation

Inventor： Randy Luhta ,  Lane Marsden ,  Ruvin Deych ,  Jeffrey Greenwald ,  Martin Choquette ,  Christopher David Tibbetts

IPC: G01T7/00 ,  G01T1/20

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

公开(公告)号：US10185043B2

公开(公告)日：2019-01-22

申请号：US15745186

申请日：2015-09-18

Applicant: ANALOGIC CORPORATION

Inventor： Randy Luhta ,  Chris Vrettos

IPC: G01T1/24 ,  H01L27/146 ,  G01T1/20 ,  H01L23/498 ,  H03M1/12

Abstract: Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.

公开(公告)号：US10007008B2

公开(公告)日：2018-06-26

申请号：US14907611

申请日：2013-07-26

Applicant: ANALOGIC CORPORATION

Inventor： Randy Luhta ,  Daniel Abenaim ,  Martin Choquette ,  Ruvin Deych ,  Chris Vrettos

IPC: G01T1/24 ,  H01L27/146 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L27/14618 ,  H01L27/14661 ,  H01L2224/16225

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

公开(公告)号：US10181493B2

公开(公告)日：2019-01-15

申请号：US15549249

申请日：2015-02-06

Applicant: ANALOGIC CORPORATION

Inventor： Daniel Abenaim ,  Randy Luhta ,  Ruvin Deych ,  Andrew Litvin

IPC: G01T1/20 ,  H01L27/146

Abstract: Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

公开(公告)号：US20170307766A1

公开(公告)日：2017-10-26

申请号：US15520439

申请日：2014-10-20

Applicant: Analogic Corporation

Inventor： Daniel Abenaim ,  Randy Luhta ,  Martin Choquette

IPC: G01T1/20 ,  G01T1/24

CPC classification number: G01T1/2018 ,  G01T1/241 ,  G01T1/244

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

公开(公告)号：US20240061131A1

公开(公告)日：2024-02-22

申请号：US18458033

申请日：2023-08-29

Applicant: Analogic Corporation

Inventor： Lane Marsden ,  Randy Luhta

IPC: G01T1/20 ,  H01L27/146 ,  G01T7/00

CPC classification number: G01T1/20188 ,  H01L27/14623 ,  H01L27/14661 ,  G01T7/00 ,  H01L27/14685 ,  H01L27/1469 ,  H01L27/14663

Abstract: A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.

公开(公告)号：US10802166B2

公开(公告)日：2020-10-13

申请号：US16378168

申请日：2019-04-08

Applicant: Analogic Corporation

Inventor： Randy Luhta ,  Lane Marsden ,  Ruvin Deych ,  Jeffrey Greenwald ,  Martin Choquette ,  Christopher David Tibbetts

IPC: G01T1/20 ,  G01T7/00 ,  H05K1/02 ,  H01L27/146

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

公开(公告)号：US10598802B2

公开(公告)日：2020-03-24

申请号：US16213509

申请日：2018-12-07

Applicant: Analogic Corporation

Inventor： Randy Luhta ,  Chris Vrettos

IPC: G01T1/24 ,  G01T1/20 ,  H01L27/146 ,  H01L23/498 ,  H03M1/12

Abstract: Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.

公开(公告)号：US20190113636A1

公开(公告)日：2019-04-18

申请号：US16213509

申请日：2018-12-07

Applicant: Analogic Corporation

Inventor： Randy Luhta ,  Chris Vrettos

IPC: G01T1/24 ,  H01L27/146 ,  H01L23/498 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L23/49816 ,  H01L27/14618 ,  H01L27/14661 ,  H01L27/14663 ,  H01L2224/32145 ,  H03M1/12

Abstract: Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.

公开(公告)号：US10254421B2

公开(公告)日：2019-04-09

申请号：US15566252

申请日：2015-09-18

Applicant: ANALOGIC CORPORATION

Inventor： Randy Luhta ,  Lane Marsden ,  Ruvin Deych ,  Jeffrey Greenwald ,  Martin Choquette ,  Christopher Tibbetts

IPC: G01T1/20 ,  G01T7/00 ,  H01L27/146

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.