Titanium nitride diffusion barrier for use in non-silicon technologies and method
    1.
    发明授权
    Titanium nitride diffusion barrier for use in non-silicon technologies and method 失效
    用于非硅技术和方法的氮化钛扩散阻挡层

    公开(公告)号:US06204560B1

    公开(公告)日:2001-03-20

    申请号:US09063173

    申请日:1998-04-20

    IPC分类号: H01L2352

    摘要: As will be described in more detail hereinafter, there is disclosed herein a titanium nitride diffusion barrier layer and associated method for use in non-silicon semiconductor technologies. In one aspect of the invention, a semiconductor device includes a non-silicon active surface. The improvement comprises an ohmic contact serving to form an external electrical connection to the non-silicon active surface in which the ohmic contact includes at least one layer consisting essentially of titanium nitride. In another aspect of the invention, a semiconductor ridge waveguide laser is disclosed which includes a semiconductor substrate and an active layer disposed on the substrate. A cladding layer is supported partially on the substrate and partially on the active layer. The cladding layer includes a ridge portion disposed in a confronting relationship with the active region. A metallization structure substantially covers the ridge portion and includes at least one layer consisting essentially of titanium nitride.

    摘要翻译: 如下文将更详细地描述的,这里公开了用于非硅半导体技术的氮化钛扩散阻挡层和相关方法。 在本发明的一个方面中,半导体器件包括非硅有源表面。 该改进包括用于形成与非硅有源表面的外部电连接的欧姆接触,其中欧姆接触包括至少一层主要由氮化钛组成的层。 在本发明的另一方面,公开了一种半导体脊波导激光器,其包括半导体衬底和设置在衬底上的有源层。 包覆层部分地支撑在衬底上并且部分地支撑在有源层上。 包覆层包括以与活性区域相对的关系设置的脊部。 金属化结构基本上覆盖脊部并且包括至少一个由氮化钛组成的层。