公开(公告)号：US20030232522A1

公开(公告)日：2003-12-18

申请号：US10393434

申请日：2003-03-20

Applicant: Andrew Corporation

Inventor： Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

IPC: H01R012/00

CPC classification number: H05K3/368 ,  B23K2101/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Abstract translation: 一种用于在两个电路板之间提供机械/电气互连的方法以及因此需要的互连部件包括每个具有尾部，肩部和头部的销和插座。 销的尾部的尺寸设计成适合于第一板的电镀通孔中，头部的尺寸被设计成允许自动装置捕获头部并且搁置在电镀通孔的顶部上，当 插入其中，并且肩部的尺寸相对于电镀通孔的尺寸，以便放置在电镀通孔内，并允许预定量的焊料在头部下方流下并进入电镀通孔，而不是如 远离尾部，从而有助于将销定位在通孔中。 在加热到回流焊温度时，围绕销的头部周边和插座的肩部的焊料环在插头的头部和插座的肩部下方流动，从而形成焊接的电气 引脚与第一板，插座和第二板之间的连接。 通过将销与插座对准并将销的尾部插入插座的空腔中，在第一板和第二板之间形成可分离的可靠的机械和电气互连。