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公开(公告)号：US08724840B2
公开(公告)日：2014-05-13
申请号：US13427550
申请日：2012-03-22
申请人： Andrew J. Doller , Michael J. Daley
发明人： Andrew J. Doller , Michael J. Daley
IPC分类号： H04R1/34
CPC分类号： H04R1/086 , H04R2499/11
摘要： A microphone with an offset acoustic channel. The microphone includes an external case, an acoustic chamber enclosure within the external case, a microphone transducer positioned within the acoustic chamber enclosure, and a gasket positioned between the external case and the acoustic chamber enclosure. A first opening in the external case is positioned an offset lateral distance from a second opening in the acoustic chamber enclosure. An acoustic channel is formed in the gasket extending from the first opening to the second opening along the offset lateral distance.
摘要翻译： 带有偏移声道的麦克风。 麦克风包括外部壳体，外部壳体内的声学室外壳，位于声学室外壳内的麦克风换能器以及定位在外部壳体和声学室外壳之间的垫圈。 在外壳中的第一开口定位在声室外壳中与第二开口偏移的横向距离。 声学通道形成在垫片中，沿着偏移横向距离从第一开口延伸到第二开口。
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公开(公告)号：US20130251183A1
公开(公告)日：2013-09-26
申请号：US13427550
申请日：2012-03-22
申请人： Andrew J. Doller , Michael J. Daley
发明人： Andrew J. Doller , Michael J. Daley
IPC分类号： H04R9/08
CPC分类号： H04R1/086 , H04R2499/11
摘要： A microphone with an offset acoustic channel. The microphone includes an external case, an acoustic chamber enclosure within the external case, a microphone transducer positioned within the acoustic chamber enclosure, and a gasket positioned between the external case and the acoustic chamber enclosure. A first opening in the external case is positioned an offset lateral distance from a second opening in the acoustic chamber enclosure. An acoustic channel is formed in the gasket extending from the first opening to the second opening along the offset lateral distance.
摘要翻译： 带有偏移声道的麦克风。 麦克风包括外部壳体，外部壳体内的声学室外壳，位于声学室外壳内的麦克风换能器以及定位在外部壳体和声学室外壳之间的垫圈。 在外壳中的第一开口定位在声室外壳中与第二开口偏移的横向距离。 声学通道形成在垫片中，沿着偏移横向距离从第一开口延伸到第二开口。
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3.发明授权公开(公告)号：US08629011B2
公开(公告)日：2014-01-14
申请号：US13161194
申请日：2011-06-15
申请人： Brett M. Diamond , Franz Laermer , Andrew J. Doller , Michael J. Daley , Phillip Sean Stetson , John M. Muza
发明人： Brett M. Diamond , Franz Laermer , Andrew J. Doller , Michael J. Daley , Phillip Sean Stetson , John M. Muza
IPC分类号： H01L21/339
CPC分类号： H04R19/005 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C2201/0119 , B81C2201/0177 , B81C2203/0714 , B81C2203/075 , B81C2203/0778 , H04R19/04 , H04R31/00
摘要： A method of manufacturing a microphone using epitaxially grown silicon. A monolithic wafer structure is provided. A wafer surface of the structure includes poly-crystalline silicon in a first horizontal region and mono-crystalline silicon in a second horizontal region surrounding a perimeter of the first horizontal region. A hybrid silicon layer is epitaxially deposited on the wafer surface. Portions of the hybrid silicon layer that contact the poly-crystalline silicon use the poly-crystalline silicon as a seed material and portions that contact the mono-crystalline silicon use the mono-crystalline silicon as a seed material. As such, the hybrid silicon layer includes both mono-crystalline silicon and poly-crystalline silicon in the same layer of the same wafer structure. A CMOS/membrane layer is then deposited on top of the hybrid silicon layer.
摘要翻译： 使用外延生长硅制造麦克风的方法。 提供了一种单片晶圆结构。 该结构的晶片表面包括第一水平区域中的多晶硅和围绕第一水平区域的周边的第二水平区域中的单晶硅。 杂化硅层外延沉积在晶片表面上。 接触多晶硅的混合硅层的部分使用多晶硅作为种子材料，并且接触单晶硅的部分使用单晶硅作为种子材料。 这样，混合硅层在同一晶片结构的相同层中包括单晶硅和多晶硅两者。 然后将CMOS /膜层沉积在混合硅层的顶部。
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4.发明申请公开(公告)号：US20120319219A1
公开(公告)日：2012-12-20
申请号：US13161194
申请日：2011-06-15
申请人： Brett M. Diamond , Franz Laermer , Andrew J. Doller , Michael J. Daley , Phillip Sean Stetson , John M. Muza
发明人： Brett M. Diamond , Franz Laermer , Andrew J. Doller , Michael J. Daley , Phillip Sean Stetson , John M. Muza
CPC分类号： H04R19/005 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C2201/0119 , B81C2201/0177 , B81C2203/0714 , B81C2203/075 , B81C2203/0778 , H04R19/04 , H04R31/00
摘要： A method of manufacturing a microphone using epitaxially grown silicon. A monolithic wafer structure is provided. A wafer surface of the structure includes poly-crystalline silicon in a first horizontal region and mono-crystalline silicon in a second horizontal region surrounding a perimeter of the first horizontal region. A hybrid silicon layer is epitaxially deposited on the wafer surface. Portions of the hybrid silicon layer that contact the poly-crystalline silicon use the poly-crystalline silicon as a seed material and portions that contact the mono-crystalline silicon use the mono-crystalline silicon as a seed material. As such, the hybrid silicon layer includes both mono-crystalline silicon and poly-crystalline silicon in the same layer of the same wafer structure. A CMOS/membrane layer is then deposited on top of the hybrid silicon layer.
摘要翻译： 使用外延生长硅制造麦克风的方法。 提供了一种单片晶圆结构。 该结构的晶片表面包括第一水平区域中的多晶硅和围绕第一水平区域的周边的第二水平区域中的单晶硅。 杂化硅层外延沉积在晶片表面上。 接触多晶硅的混合硅层的部分使用多晶硅作为种子材料，并且接触单晶硅的部分使用单晶硅作为种子材料。 这样，混合硅层在同一晶片结构的相同层中包括单晶硅和多晶硅两者。 然后将CMOS /膜层沉积在混合硅层的顶部。
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公开(公告)号：US20130034257A1
公开(公告)日：2013-02-07
申请号：US13196652
申请日：2011-08-02
CPC分类号： H04R19/005 , H04R31/00 , H04R2201/003 , Y10T29/49005
摘要： A MEMS microphone. The MEMS microphone includes a substrate, a transducer support that includes or supports a transducer, a housing, and an acoustic channel. The transducer support resides on the substrate. The housing surrounds the transducer support and includes an acoustic aperture. The acoustic channel couples the acoustic aperture to the transducer, and isolates the transducer from an interior area of the MEMS microphone.
摘要翻译： 一个MEMS麦克风。 MEMS麦克风包括基底，包括或支撑换能器的换能器支架，壳体和声通道。 传感器支架位于基板上。 壳体围绕换能器支撑并且包括声孔。 声通道将声孔连接到换能器，并将换能器与MEMS麦克风的内部区域隔离开。
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公开(公告)号：US08948420B2
公开(公告)日：2015-02-03
申请号：US13196652
申请日：2011-08-02
CPC分类号： H04R19/005 , H04R31/00 , H04R2201/003 , Y10T29/49005
摘要： A MEMS microphone. The MEMS microphone includes a substrate, a transducer support that includes or supports a transducer, a housing, and an acoustic channel. The transducer support resides on the substrate. The housing surrounds the transducer support and includes an acoustic aperture. The acoustic channel couples the acoustic aperture to the transducer, and isolates the transducer from an interior area of the MEMS microphone.
摘要翻译： 一个MEMS麦克风。 MEMS麦克风包括基底，包括或支撑换能器的换能器支架，壳体和声通道。 传感器支架位于基板上。 壳体围绕换能器支撑并且包括声孔。 声通道将声孔连接到换能器，并将换能器与MEMS麦克风的内部区域隔离开。
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