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公开(公告)号：US20220003927A1
公开(公告)日：2022-01-06
申请号：US17364279
申请日：2021-06-30
发明人： Avi Feshali , Mario Paniccia , Warren Bruce Jin
摘要： Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement.
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公开(公告)号：US11442226B2
公开(公告)日：2022-09-13
申请号：US17364279
申请日：2021-06-30
发明人： Avi Feshali , Mario Paniccia , Warren Bruce Jin
摘要： Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement.
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3.发明公开公开(公告)号：US20240337790A1
公开(公告)日：2024-10-10
申请号：US18542421
申请日：2023-12-15
发明人： Avi Feshali , Mario Paniccia , Warren Bruce Jin
CPC分类号： G02B6/125 , G01C19/72 , G02B6/1225 , G02B2006/12107 , G02B2006/12138
摘要： Aspects of the present disclosure are directed to introducing structural modifications in a waveguide-based optical structure in order to more tightly pack adjacent waveguide turns in the optical structure. The optical structure can be used as the rotational sensing element of an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of a waveguide-based gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement. The structural modifications can be in the form of air-gaps or fluid-filled or metal-filled gaps, or various types of sub-wavelength structures (like gratings or photonic crystals).
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4.发明授权公开(公告)号：US11803013B2
公开(公告)日：2023-10-31
申请号：US17710847
申请日：2022-03-31
发明人： Avi Feshali , Warren Bruce Jin , Mario Paniccia
CPC分类号： G02B6/13 , G01C19/64 , G02B6/12004
摘要： Aspects of the present disclosure are directed to fabrication of large-footprint chips having integrated photonic components comprising low-loss optical waveguides. The large footprint chips require the use of multiple reticles during fabrication. Stitching adjacent reticle fields seamlessly is accomplished by overlaying into adjacent reticle fields, tapering waveguide ends, and using strategically placed alignment marks in the die.
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公开(公告)号：US11846805B2
公开(公告)日：2023-12-19
申请号：US17942840
申请日：2022-09-12
发明人： Avi Feshali , Mario Paniccia , Warren Bruce Jin
CPC分类号： G02B6/125 , G01C19/72 , G02B6/1225 , G02B2006/12107 , G02B2006/12138
摘要： Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement.
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6.发明公开公开(公告)号：US20230185023A1
公开(公告)日：2023-06-15
申请号：US17942840
申请日：2022-09-12
发明人： Avi Feshali , Mario Paniccia , Warren Bruce Jin
CPC分类号： G02B6/125 , G01C19/72 , G02B6/1225 , G02B2006/12107
摘要： Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement.
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7.发明申请公开(公告)号：US20220317373A1
公开(公告)日：2022-10-06
申请号：US17710847
申请日：2022-03-31
发明人： Avi Feshali , Warren Bruce Jin , Mario Paniccia
摘要： Aspects of the present disclosure are directed to fabrication of large-footprint chips having integrated photonic components comprising low-loss optical waveguides. The large footprint chips require the use of multiple reticles during fabrication. Stitching adjacent reticle fields seamlessly is accomplished by overlaying into adjacent reticle fields, tapering waveguide ends, and using strategically placed alignment marks in the die.
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