公开(公告)号：US20050124141A1

公开(公告)日：2005-06-09

申请号：US11036148

申请日：2005-01-14

申请人： Annayya Deshpande ,  Calvin Lo ,  Kevin Luong ,  Artemio Torres

发明人： Annayya Deshpande ,  Calvin Lo ,  Kevin Luong ,  Artemio Torres

IPC分类号： B28D5/00 ,  B28D5/02 ,  G11B5/31 ,  G11B5/127 ,  H01L21/301 ,  H01L21/46 ,  H01L21/78

CPC分类号： B28D5/022

摘要： A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.