利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.029 秒)

    Tape head read/write module
    1.
    发明授权
    Tape head read/write module 失效
    磁头读/写模块

    公开(公告)号：US07492552B2

    公开(公告)日：2009-02-17

    申请号：US11833973

    申请日：2007-08-04

    申请人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    发明人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    IPC分类号： G11B5/127

    CPC分类号： G11B5/105 ,  G11B5/00821 ,  G11B5/60 ,  G11B15/62

    摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

    摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。

    Method and apparatus for embedding a chip in a substrate to form a composite air bearing surface
    2.
    发明授权
    Method and apparatus for embedding a chip in a substrate to form a composite air bearing surface 失效
    将芯片嵌入基板以形成复合空气轴承表面的方法和装置

    公开(公告)号：US07082013B2

    公开(公告)日：2006-07-25

    申请号：US10431247

    申请日：2003-05-06

    申请人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    发明人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    IPC分类号： G11B17/32

    CPC分类号： G11B5/105 ,  G11B5/00821 ,  G11B5/60 ,  G11B15/62

    摘要： A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

    摘要翻译： 一种用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 该方法的一个实例包括将基板固定在固定位置，将芯片沿第一方向与衬底中的芯片接收槽对准，在芯片接收槽中沉积粘合剂，并将芯片沿第二方向与芯片接收 槽 芯片被推入到芯片接收槽中的粘合剂中，直到芯片的空气支承表面相对于衬底的空气轴承表面在第三方向上基本上处于期望的突起。 粘合剂在芯片的空气支承表面基本上在第三方向上以期望的突起固化，并且芯片在第一和第二方向上基本上与芯片接收槽对齐。

    Tape head read/write module
    3.
    发明授权
    Tape head read/write module 失效
    磁头读/写模块

    公开(公告)号：US07274536B2

    公开(公告)日：2007-09-25

    申请号：US11449443

    申请日：2006-06-07

    申请人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    发明人： Annayya P. Deshpande ,  Hoodin Hamidi ,  Icko E. Iben ,  Kevin Thuy Luong ,  Sassan K. Shahidi ,  Abel J. Taina

    IPC分类号： G11B5/127

    CPC分类号： G11B5/105 ,  G11B5/00821 ,  G11B5/60 ,  G11B15/62

    摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

    摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。