-
1.发明授权Thin-film tape head having single groove formed in head body and corresponding process 失效薄膜磁带头在头体中形成单槽，并具有相应的工艺公开(公告)号：US07161764B2
公开(公告)日：2007-01-09
申请号：US09938458
申请日：2001-08-23
申请人： Robert G. Biskeborn , Annayya P. Deshpande , Calvin S. Lo , Kevin T. Luong , Abel J. Taina , Artemio-Juan Torres
发明人： Robert G. Biskeborn , Annayya P. Deshpande , Calvin S. Lo , Kevin T. Luong , Abel J. Taina , Artemio-Juan Torres
CPC分类号： G11B5/3173 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B5/584 , G11B5/588 , Y10T29/49021 , Y10T29/49032 , Y10T29/49044 , Y10T29/53165
摘要： A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.
摘要翻译： 根据另一实施例的磁头包括：头本体，包括顶面，底面，一对细长侧面和一对短端面; 至少一个与所述头体的顶面连通的换能器; 以及形成在头本体的顶面中并在换能器与头本体的一个侧面之间延伸的单个槽。 还提出了一种用于制造磁头的方法。
-
公开(公告)号：US20080218904A1
公开(公告)日：2008-09-11
申请号：US12106983
申请日：2008-04-21
IPC分类号： G11B15/60
CPC分类号： B28D5/022
摘要： An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.
摘要翻译： 一种电子部件，包括：从晶片切割的一部分行; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层。
-
公开(公告)号：US07446974B2
公开(公告)日：2008-11-04
申请号：US11036148
申请日：2005-01-14
IPC分类号： G11B5/147
CPC分类号： B28D5/022
摘要： An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的电子部件包括从晶片切割的行的一部分; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层，其中耦合到接合区域的粘合剂与封闭件间隔开。 还介绍了其他系统和方法。
-
公开(公告)号：US06468376B2
公开(公告)日：2002-10-22
申请号：US09754498
申请日：2001-01-03
IPC分类号： B30B1500
摘要： A precision clamping apparatus is described which is suitable for use with a high temperature curing process. A clamp according to the invention includes a base plate with a supporting surface for a component (which consists of two portions to be bonded together), and at least two alignment stops against which the first and second sides of the component can be pressed. A pressure plate is provided to mate with the base plate to exert uniform clamping force on the component to allow a uniform thickness of cured adhesive to form between internal surfaces of the component. The pressure plate is precisely aligned with the supporting surface in the horizontal plane by guides which allow vertical movement. The pressure plate is made self-aligning with the surface of the component by being urged toward the supporting surface by a resilient structure which is in turn held in position by attachment to the base plate. Adjustable lateral fingers are provided to urge the component against the alignment stops.
-
公开(公告)号：US08111480B2
公开(公告)日：2012-02-07
申请号：US12106983
申请日：2008-04-21
IPC分类号： G11B15/60
CPC分类号： B28D5/022
摘要： An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.
摘要翻译： 一种电子部件，包括：从晶片切割的一部分行; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘相耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层。
-
公开(公告)号：US06863061B2
公开(公告)日：2005-03-08
申请号：US10346033
申请日：2003-01-15
CPC分类号： B28D5/022
摘要： A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
摘要翻译： 一种用于切片薄膜晶片的方法和机构。 封闭件结合到薄膜晶片的一部分。 刀片用于通过切割封盖和薄膜晶片从晶片的部分切片一排，使得叶片的相对侧面接合封闭件的相等表面积。
-
公开(公告)号：US07492552B2
公开(公告)日：2009-02-17
申请号：US11833973
申请日：2007-08-04
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B5/127
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。
-
公开(公告)号：US07274536B2
公开(公告)日：2007-09-25
申请号：US11449443
申请日：2006-06-07
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B5/127
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。
-
9.发明授权Method and apparatus for embedding a chip in a substrate to form a composite air bearing surface 失效将芯片嵌入基板以形成复合空气轴承表面的方法和装置公开(公告)号：US07082013B2
公开(公告)日：2006-07-25
申请号：US10431247
申请日：2003-05-06
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B17/32
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.
摘要翻译： 一种用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 该方法的一个实例包括将基板固定在固定位置，将芯片沿第一方向与衬底中的芯片接收槽对准，在芯片接收槽中沉积粘合剂，并将芯片沿第二方向与芯片接收 槽 芯片被推入到芯片接收槽中的粘合剂中，直到芯片的空气支承表面相对于衬底的空气轴承表面在第三方向上基本上处于期望的突起。 粘合剂在芯片的空气支承表面基本上在第三方向上以期望的突起固化，并且芯片在第一和第二方向上基本上与芯片接收槽对齐。
-
10.发明授权
公开(公告)号：US5266769A
公开(公告)日：1993-11-30
申请号：US841934
申请日：1992-02-25
CPC分类号： G11B5/6005
摘要： A method for making a magnetic head slider comprising the steps of lapping the slider to form an air bearing surface, producing a chosen pattern of rails on the air bearing surface, and producing a chosen pattern of stress on the back side of the slider to remove the distortion produced in the slider by the lapping and rail formation steps. The stress pattern can be chosen to produce any desired range of crown and camber for the slider.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.025 秒)