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公开(公告)号：US5433885A
公开(公告)日：1995-07-18
申请号：US75231
申请日：1993-06-10
申请人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
发明人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26 , B08B3/04
CPC分类号： H05K3/26 , C11D3/08 , C11D3/10 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K2203/0793 , H05K2203/122
摘要： The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer comprising a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
摘要翻译： 本发明涉及水性清洁组合物，例如用于家用或用于清洁包含碱性盐，碱金属硅酸盐的电子电路组件以增强洗涤作用或为被清洁的基底提供腐蚀保护，以及包含高 分子量聚丙烯酸，其稳定碱金属硅酸盐以防止硅酸盐从溶液中沉淀。
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公开(公告)号：US5549761A
公开(公告)日：1996-08-27
申请号：US417881
申请日：1995-04-06
申请人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
发明人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26 , B08B3/04 , C23G5/06
CPC分类号： H05K3/26 , C11D3/08 , C11D3/10 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K2203/0793 , H05K2203/122
摘要： A method for removing rosin soldering flux with aqueous cleaning compositions. The aqueous cleaning compositions can be employed for household use or for cleaning electronic circuit assemblies. The aqueous cleaning compositions contain an alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer of a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
摘要翻译： 一种用水性清洁组合物去除松香助焊剂的方法。 水性清洁组合物可用于家用或清洁电子电路组件。 含水清洗组合物含有碱金属盐，碱金属硅酸盐以提高去污作用或为被清洗的基材提供腐蚀保护，以及稳定碱金属硅酸盐以防止沉淀的高分子量聚丙烯酸的阴离子聚合物 硅酸盐溶液。
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公开(公告)号：US5431847A
公开(公告)日：1995-07-11
申请号：US136390
申请日：1993-10-13
申请人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
发明人： Anthony E. Winston , Steven E. Dunn , Francis R. Cala , Alfredo Vinci , M. Stephen Lajoie , Robert C. Jorgensen
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26
CPC分类号： C11D3/08 , C11D3/10 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： The present invention is directed to aqueous cleaning concentrates such as for cleaning electronic circuit assemblies comprising 15-30 wt. % of a composition containing alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned, an anionic polymer comprising a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution, surfactants, and a hydrotrope to maintain the surfactants in solution and the balance water.
摘要翻译： 本发明涉及水性清洁浓缩物，例如用于清洁包含15-30重量％的电子电路组件的电子电路组件。 ％的含碱性盐的组合物，碱金属硅酸盐以提高去污作用或为被清洗的基材提供防腐蚀保护，包含稳定碱金属硅酸盐以防止硅酸盐沉淀的高分子量聚丙烯酸的阴离子聚合物 从溶液，表面活性剂和水溶助长剂中将表面活性剂保持在溶液中并使水分平衡。
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公开(公告)号：US5397495A
公开(公告)日：1995-03-14
申请号：US73495
申请日：1993-06-09
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26 , C11D9/12
CPC分类号： H05K3/26 , C11D3/08 , C11D3/10 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K2203/0793 , H05K2203/122
摘要： The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
摘要翻译： 本发明涉及水性清洁组合物，例如用于家用或用于清洁包含碱性盐，碱金属硅酸盐的电子电路组件以增强除尘作用或为被清洁的基底提供腐蚀保护，以及使稳定化的阴离子聚合物 碱金属硅酸盐，以防止硅酸盐从溶液中沉淀。
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公开(公告)号：USRE35115E
公开(公告)日：1995-12-12
申请号：US257664
申请日：1994-06-08
CPC分类号： H05K3/26 , C23G1/20 , H05K2203/0793 , H05K2203/122
摘要： The present invention relates to environmentally safe aqueous cleaning compositions comprising alkaline salts, organic adjuvants and a hydrotrope comprised of alkali metal salts of carboxylic acids having a chain length of 7-13 carbon atoms so as to maintain the organic adjuvant in solution.
摘要翻译： 本发明涉及环境安全的水性清洁组合物，其包含碱性盐，有机助剂和由链长为7-13个碳原子的羧酸碱金属盐组成的水溶助长剂，以便将有机助剂保持在溶液中。
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公开(公告)号：US5264047A
公开(公告)日：1993-11-23
申请号：US896379
申请日：1992-06-10
IPC分类号： C11D1/72 , C11D1/74 , C11D3/06 , C11D3/08 , C11D3/10 , C11D3/20 , C11D10/04 , C23G1/14 , C23G1/20 , H05K3/26 , B08B3/04
CPC分类号： C11D3/0026 , C11D10/045 , C11D3/06 , C11D3/08 , C11D3/10 , C11D3/2079 , C11D3/2086 , C23G1/14 , C23G1/20 , H05K3/26 , C11D1/72 , C11D1/74 , H05K2203/0793 , H05K2203/122
摘要： The present invention relates to environmentally safe aqueous cleaning compositions comprising alkaline salts, organic adjuvants and a hydrotrope comprised of alkali metal salts of carboxylic acids having a chain length of 7-13 carbon atoms so as to maintain the organic adjuvant in solution.
摘要翻译： 本发明涉及环境安全的水性清洁组合物，其包含碱性盐，有机助剂和由链长为7-13个碳原子的羧酸碱金属盐组成的水溶助长剂，以便将有机助剂保持在溶液中。
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公开(公告)号：US5234505A
公开(公告)日：1993-08-10
申请号：US896381
申请日：1992-06-10
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26
CPC分类号： H05K3/26 , C11D3/08 , C11D3/10 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K2203/0793 , H05K2203/122
摘要： The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
摘要翻译： 本发明涉及水性清洁组合物，例如用于家用或用于清洁包含碱性盐，碱金属硅酸盐的电子电路组件以增强除尘作用或为被清洁的基底提供腐蚀保护，以及使稳定化的阴离子聚合物 碱金属硅酸盐，以防止硅酸盐从溶液中沉淀。
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公开(公告)号：US5464553A
公开(公告)日：1995-11-07
申请号：US110992
申请日：1993-08-24
IPC分类号： C11D1/72 , C11D1/74 , C11D3/06 , C11D3/08 , C11D3/10 , C11D3/20 , C11D10/04 , C23G1/14 , C23G1/20 , H05K3/26 , C11D9/00
CPC分类号： C11D3/0026 , C11D10/045 , C11D3/06 , C11D3/08 , C11D3/10 , C11D3/2079 , C11D3/2086 , C23G1/14 , C23G1/20 , H05K3/26 , C11D1/72 , C11D1/74 , H05K2203/0793 , H05K2203/122
摘要： The present invention relates to environmentally safe aqueous cleaning compositions comprising alkaline salts, organic adjuvants and a hydrotrope comprised of alkali metal salts of carboxylic acids having a chain length of 7-13 carbon atoms so as to maintain the organic adjuvant in solution.
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9.再颁专利Method for removing soldering flux with alkaline salts, an alkali metal silicate and anionic polymer 失效用碱性盐，碱金属硅酸盐和阴离子聚合物去除焊剂的方法
公开(公告)号：USRE35017E
公开(公告)日：1995-08-15
申请号：US255979
申请日：1994-06-08
IPC分类号： C11D3/08 , C11D3/10 , C11D3/22 , C11D3/37 , C11D7/12 , C11D7/14 , C11D7/26 , C23G1/20 , H05K3/26 , C23G5/06
CPC分类号： C11D3/10 , C11D3/08 , C11D3/225 , C11D3/3765 , C11D7/12 , C11D7/14 , C11D7/265 , C11D7/268 , C23G1/20 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
摘要翻译： 本发明涉及水性清洁组合物，例如用于家用或用于清洁包含碱性盐，碱金属硅酸盐的电子电路组件以增强除尘作用或为被清洁的基底提供腐蚀保护，以及使稳定化的阴离子聚合物 碱金属硅酸盐，以防止硅酸盐从溶液中沉淀。
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公开(公告)号：US5264046A
公开(公告)日：1993-11-23
申请号：US896365
申请日：1992-06-10
CPC分类号： C23G1/20 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： The present invention relates to environmentally safe aqueous flux removing compositions for cleaning electronic circuit assemblies, such as printed circuit or printed wiring boards, during their fabrication. Alkaline salts are utilized preferably with various adjuvants, such as an anti-corrosion agent and antifoam agent to achieve a variety of objectives, among which are the removal of solder flux, oils, waxes, and greasy substances and adhesive and other residues.
摘要翻译： 本发明涉及用于在其制造期间清洁电子电路组件（例如印刷电路或印刷电路板）的环境安全的水性助焊剂去除组合物。 优选使用碱性盐与各种佐剂，例如防腐蚀剂和消泡剂，以实现各种目的，其中除去助焊剂，油，蜡和油腻物质以及粘合剂和其它残余物。
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