EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL
    2.
    发明申请
    EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL 失效
    用于ECMP和BARRIER移除的扩展垫生活

    公开(公告)号:US20080242202A1

    公开(公告)日:2008-10-02

    申请号:US11695484

    申请日:2007-04-02

    IPC分类号: B24B7/22

    CPC分类号: B23H5/08

    摘要: A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.

    摘要翻译: 描述了一种用于在具有多个压板的抛光工具上延伸抛光制品寿命的方法和装置。 该设备包括具有可在其上使用的抛光制品的多个实施例的可推进的辊对辊压盘。 抛光制品适于通过从衬底移除导电和电介质材料,同时最小化抛光工具的停机时间来执行抛光工艺。 在一些实施例中,抛光制品可以是介电材料或导电材料,并且被配置为包括更长的可用寿命以最小化工具的更换和停机时间。

    SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING THE SAME 审中-公开
    柔性导电聚合物加工垫及其制造方法

    公开(公告)号:US20070218587A1

    公开(公告)日:2007-09-20

    申请号:US11683197

    申请日:2007-03-07

    IPC分类号: H01L21/00

    摘要: Embodiments of the invention generally provide a conductive processing pad and a method for fabricating the same. In one embodiment the conductive processing pad includes a grid of conductive material disposed in a polymer layer. A plurality of perforations is formed through the polymer in the open area defined by the grid such that the side walls of the perforations do not expose the conductive grid. In another embodiment, a method for forming a conductive pad is provided. In one embodiment, the method includes the steps of pressing a conductive grid into a polymer sheet at a temperature greater than the polymer's last transition temperature but lower than the melting point of the material comprising the conductive grid and perforating the polymer sheet through the open area defined by the grid without exposing the conductive grid.

    摘要翻译: 本发明的实施例通常提供导电加工垫及其制造方法。 在一个实施例中,导电处理垫包括布置在聚合物层中的导电材料格栅。 在由栅格限定的开放区域中通过聚合物形成多个穿孔,使得穿孔的侧壁不暴露导电栅格。 在另一个实施例中,提供了形成导电焊盘的方法。 在一个实施方案中,该方法包括以下步骤:在高于聚合物的最后转变温度但低于包含导电栅格的材料的熔点并且通过开放区域穿孔聚合物片材的温度下将导电栅格压入聚合物片材 由栅格定义而不暴露导电栅格。

    Extended pad life for ECMP and barrier removal
    4.
    发明授权
    Extended pad life for ECMP and barrier removal 失效
    ECMP延长垫片寿命和屏障去除

    公开(公告)号:US08012000B2

    公开(公告)日:2011-09-06

    申请号:US11695484

    申请日:2007-04-02

    IPC分类号: B24D11/02

    CPC分类号: B23H5/08

    摘要: A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.

    摘要翻译: 描述了一种用于在具有多个压板的抛光工具上延伸抛光制品寿命的方法和装置。 该设备包括具有可在其上使用的抛光制品的多个实施例的可推进的辊对辊压盘。 抛光制品适于通过从衬底移除导电和电介质材料,同时最小化抛光工具的停机时间来执行抛光工艺。 在一些实施例中,抛光制品可以是介电材料或导电材料,并且被配置为包括更长的可用寿命以最小化工具的更换和停机时间。

    Wafer processing reactor having a gas flow control system and method
    5.
    发明授权
    Wafer processing reactor having a gas flow control system and method 有权
    具有气体流量控制系统和方法的晶圆处理反应器

    公开(公告)号:US6143080A

    公开(公告)日:2000-11-07

    申请号:US493492

    申请日:2000-01-28

    摘要: A wafer processing system for delivering a processing gas and an inert gas to a chamber which includes a CVD processing region having a plurality of gas flow paths for conveying the gases to the chamber and exhausting them from the chamber. A flow control system is coupled to each of the exhaust gas flow paths and each of the process gas exhaust flow paths are separately controlled to maintain a constant rate of flow within each of the gas flow paths, independent of the accumulation of deposition byproducts. Utilization of a self-cleaning orifice allows a pressure differential measurement in a process exhaust line to measure flow. The wafer processing system is provided with load and unload regions surrounding the chamber(s), each having additional inert gas exhaust flow paths. A flow characteristic, preferably pressure differential across an orifice, of the gases in each of the regions is measured and a flow control unit is selectively adjusted to maintain a substantially constant exhaust flow rate from each of the regions, in order to compensate for any pressure imbalance across the chamber due to internal (thermal load) or external (environmental) asymmetry that would degrade the performance of an APCVD system.

    摘要翻译: 一种用于将处理气体和惰性气体输送到腔室的晶片处理系统,该腔室包括具有多个气体流路的CVD处理区域,用于将气体输送到腔室并将其从腔室排出。 流量控制系统耦合到每个废气流动路径,并且每个处理气体排放流动路径被分开地控制,以在每个气体流动路径内保持恒定的流量,而与沉积副产物的积累无关。 自清洁孔的利用允许过程排气管线中的压差测量来测量流量。 晶片处理系统设置有围绕室的负载和卸载区域,每个具有附加的惰性气体排出流动路径。 测量每个区域中的气体的流动特性,优选跨孔的压力差,并且选择性地调节流量控制单元以保持来自每个区域的基本恒定的排气流速,以便补偿任何压力 由于内部(热负荷)或外部(环境)不对称性,室内的不平衡会降低APCVD系统的性能。