Encapsulation Layers with Improved Reliability
    1.
    发明申请
    Encapsulation Layers with Improved Reliability 有权
    具有提高可靠性的封装层

    公开(公告)号:US20150333293A1

    公开(公告)日:2015-11-19

    申请号:US14705364

    申请日:2015-05-06

    Applicant: Apple Inc.

    CPC classification number: H01L51/5253 H01L27/32 H01L51/56

    Abstract: An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

    Abstract translation: 电子设备可以包括具有形成在基板上的有机发光二极管的阵列的显示器。 可以在有机发光二极管的阵列之上形成封装层,以保护有机发光二极管免受湿气和其它污染物的影响。 封装层可以包括介于上下无机膜之间的透明材料片。 通过将一个或两个无机膜分成多个子层来增加封装层的可靠性。 子层可以具有不同的密度并且可以按顺序沉积。 可以通过在有机发光二极管上形成共形薄膜涂层来提供额外的防潮保护。 保形薄膜涂层可以是使用原子层沉积技术形成的氧化铝层。

    Encapsulation layers with improved reliability

    公开(公告)号:US09818976B2

    公开(公告)日:2017-11-14

    申请号:US14705364

    申请日:2015-05-06

    Applicant: Apple Inc.

    CPC classification number: H01L51/5253 H01L27/32 H01L51/56

    Abstract: An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

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