Abstract:
The described embodiments relate to methods and apparatus for improving pick and place operations. Pick and place operations involving the movement of flexible substrates can be improved by cooling a flexible substrate below a threshold temperature at which the flexible substrate transitions from a flexible state to a rigid state. Once in the rigid state, the flexible substrate can be handled and maneuvered by pick and place operations for a period of time with a limited risk of the flexible substrate wrinkling and tearing. In some embodiments, the flexible substrate is a thin polymeric substrate used to separate oppositely charged battery cells within a battery assembly.
Abstract:
The described embodiments relate to methods and apparatus for improving pick and place operations. Pick and place operations involving the movement of flexible substrates can be improved by cooling a flexible substrate below a threshold temperature at which the flexible substrate transitions from a flexible state to a rigid state. Once in the rigid state, the flexible substrate can be handled and maneuvered by pick and place operations for a period of time with a limited risk of the flexible substrate wrinkling and tearing. In some embodiments, the flexible substrate is a thin polymeric substrate used to separate oppositely charged battery cells within a battery assembly.