公开(公告)号：US20130063914A1

公开(公告)日：2013-03-14

申请号：US13668692

申请日：2012-11-05

Applicant: Apple Inc.

Inventor： Gloria Lin ,  Bryson Gardner, JR. ,  Joseph Fisher, JR. ,  Dennis Pyper ,  Amir Salehi

IPC: H05K7/00

CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，模块可以包括电气系统的一个或多个无源元件和/或主动元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其他合适实体的其他实体。