公开(公告)号：US09733670B2

公开(公告)日：2017-08-15

申请号：US13627814

申请日：2012-09-26

Applicant: Apple Inc.

Inventor： Dinesh C. Mathew ,  Edward J. Cooper ,  Brett W. Degner ,  Keith J. Hendren ,  Nicholas Alan Rundle ,  Dave Tarkington

IPC: G06F1/16 ,  H05K13/00 ,  H04N5/64

CPC classification number: G06F1/1637 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1607 ,  G06F1/1609 ,  G06F2200/1612 ,  H04N5/64 ,  H05K13/00 ,  Y10T29/49002

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

公开(公告)号：US11604491B2

公开(公告)日：2023-03-14

申请号：US15649164

申请日：2017-07-13

Applicant: Apple Inc.

Inventor： Dinesh C. Mathew ,  Edward J. Cooper ,  Brett W. Degner ,  Keith J. Hendren ,  Nicholas Alan Rundle ,  Dave Tarkington

IPC: G06F1/00 ,  G06F1/16 ,  H05K13/00 ,  H04N5/64

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

公开(公告)号：US20170308124A1

公开(公告)日：2017-10-26

申请号：US15649164

申请日：2017-07-13

Applicant: Apple Inc.

Inventor： Dinesh C. Mathew ,  Edward J. Cooper ,  Brett W. Degner ,  Keith J. Hendren ,  Nicholas Alan Rundle ,  Dave Tarkington

IPC: G06F1/16 ,  H04N5/64 ,  H05K13/00

CPC classification number: G06F1/1637 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1607 ,  G06F1/1609 ,  G06F2200/1612 ,  H04N5/64 ,  H05K13/00 ,  Y10T29/49002

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.