公开(公告)号：US20140166867A1

公开(公告)日：2014-06-19

申请号：US13718850

申请日：2012-12-18

Applicant: APPLE INC.

Inventor： Boon W. Shiu ,  David Lin Lee ,  Michael DiVincent

IPC: G01J1/02

CPC classification number: G01J1/0271 ,  G01J1/0425 ,  G01J1/0444 ,  G01J1/4204 ,  G01J1/4228 ,  H04M1/22

Abstract: Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.

Abstract translation: 电子设备可以设置有光传感器。 光传感器可以是接近传感器或环境光传感器。 接近传感器可以包括发光部件和感光部件。 电子设备可以包括由壳体结构形成的外壳和用于该装置的显示器的部分或全部。 外壳可以包括开口，例如由较小开口的簇形成的开口。 每个光传感器可以通过一组开口接收光。 光传感器可以直接通过开口接收光，或者可以接收穿过开口的光，并通过光导结构被引导到光传感器。 光引导结构可以包括光纤结构或光反射结构。 光纤结构可以填充或部分填充开口。 光反射结构可以在内部支撑结构中被加工成腔。

公开(公告)号：US09664555B2

公开(公告)日：2017-05-30

申请号：US13718850

申请日：2012-12-18

Applicant: Apple Inc.

Inventor： Boon W. Shiu ,  David Lin Lee ,  Michael DiVincent

IPC: G01J1/02 ,  G01J1/04 ,  G01J1/42 ,  H04M1/22

CPC classification number: G01J1/0271 ,  G01J1/0425 ,  G01J1/0444 ,  G01J1/4204 ,  G01J1/4228 ,  H04M1/22

Abstract: Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.