公开(公告)号：US20240074665A1

公开(公告)日：2024-03-07

申请号：US18147628

申请日：2022-12-28

Applicant: Apple Inc.

Inventor： Daniel J. Hiemstra ,  Jeffrey W. Buchholz ,  Xiaofan Niu ,  James C. Clements ,  Wei Lin ,  Habib S. Karaki ,  Paul Mansky ,  Boyi Fu ,  Yanfeng Chen ,  Edmilson Besseler

IPC: A61B5/01 ,  A61B5/00 ,  G01K13/20

CPC classification number: A61B5/01 ,  A61B5/681 ,  A61B5/7203 ,  A61B5/7246 ,  G01K13/20 ,  A61B2562/0271 ,  A61B2562/12

Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.