公开(公告)号：US09853402B2

公开(公告)日：2017-12-26

申请号：US15151288

申请日：2016-05-10

Applicant: Apple Inc.

Inventor： Anton Talalayev ,  David H. Narajowski ,  Christiaan A. Ligtenberg ,  Mahmoud R. Amini ,  William F. Leggett ,  Mikael M. Silvanto ,  Christopher J. Stringer ,  George Tziviskos ,  Edward Cooper ,  Ron Alan Hopkinson ,  Ari Parsons Miller

IPC: H01R13/648 ,  H01R24/60 ,  H01R13/6583 ,  H01R12/70

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

公开(公告)号：US20170093099A1

公开(公告)日：2017-03-30

申请号：US15151288

申请日：2016-05-10

Applicant: Apple Inc.

Inventor： Anton Talalayev ,  David H. Narajowski ,  Christiaan A. Ligtenberg ,  Mahmoud R. Amini ,  William F. Leggett ,  Mikael M. Silvanto ,  Christopher J. Stringer ,  George Tziviskos ,  Edward Cooper

IPC: H01R24/60 ,  H01R12/70 ,  H01R13/6583

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.