公开(公告)号：US20180083322A1

公开(公告)日：2018-03-22

申请号：US15712068

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  James A. BERTIN ,  Eric M. BENNETT ,  Simon C. HELMORE ,  Melissa A. WAH ,  Matthew D. HILL ,  Jon F. HOUSOUR ,  Douglas G. FOURNIER ,  Christopher S. TOMASETTA

IPC: H01M10/42 ,  H01M4/04 ,  H01M2/10 ,  G06F3/041

Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.

公开(公告)号：US20200281097A1

公开(公告)日：2020-09-03

申请号：US16875799

申请日：2020-05-15

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  James A. BERTIN ,  Eric M. BENNETT ,  Simon C. HELMORE ,  Melissa A. WAH ,  Matthew D. HILL ,  Jon F. HOUSOUR ,  Douglas G. FOURNIER ,  Christopher S. TOMASETTA

IPC: H05K7/20 ,  G06F1/16 ,  H05K9/00 ,  H05K1/14 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02

Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.

公开(公告)号：US20180084680A1

公开(公告)日：2018-03-22

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. JARVIS ,  David A. PAKULA ,  David J. DUNSMOOR ,  Ian A. SPRAGGS ,  Lee E. HOOTON ,  Marwan RAMMAH ,  Matthew D. HILL ,  Robert F. MEYER ,  James A. BERTIN ,  Eric M. BENNETT ,  Simon C. HELMORE ,  Melissa A. WAH ,  Jon F. HOUSOUR ,  Douglas G. FOURNIER ,  Christopher S. TOMASETTA

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K7/20963

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.