3D FLEX SOLDERING
    2.
    发明申请

    公开(公告)号:US20160095204A1

    公开(公告)日:2016-03-31

    申请号:US14574191

    申请日:2014-12-17

    Applicant: Apple Inc.

    Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

    Abstract translation: 在某些设计中,使柔性电路(flex)呈现弯曲状态可有助于有效地布线导电通路。 在回流操作期间实现弯曲状态下的弯曲焊接的一种有效方式是操纵镶板,其将多个弯曲部分保持在可弯曲的位置,以可靠地保持弯曲。 在一些实施例中,柔性件可以在回流操作期间表面安装到电气设备的一部分或全部,在此期间,弯曲状态通过至少部分地附接到柔性件的周边的镶板来保持。 另一个解决方案是在表面安装和回流操作期间利用真空或热胶装置来保持弯曲。

    BATTERY REMOVAL APPARATUS
    6.
    发明申请
    BATTERY REMOVAL APPARATUS 有权
    电池拆卸设备

    公开(公告)号:US20140355207A1

    公开(公告)日:2014-12-04

    申请号:US13903867

    申请日:2013-05-28

    Applicant: Apple Inc.

    CPC classification number: H01M10/425 G06F1/1635 H01M2/1066 Y10T156/1994

    Abstract: This application relates generally to battery removal apparatuses. For example, one battery removal apparatus disclosed herein comprises a pull tab configured to be disposed between a battery and a casing of a portable computing device. The pull tab is shaped such that at least one area of the battery and the casing are exposed to one another when the battery, the pull tab and the casing are compressed together. An adhesive layer is shaped to cover the at least one exposed area such that the battery adheres to the casing, and the pull tab is reinforced so as to prevent the pull tab from tearing when used to remove the battery from the portable computing device. Other battery removal apparatuses include a pull string battery removal apparatus as well as a battery removal apparatus that incorporates both a pull tab and one or more pull strings.

    Abstract translation: 本申请一般涉及电池去除装置。 例如,本文公开的一个电池移除装置包括配置成设置在电池和便携式计算装置的壳体之间的拉片。 拉片被成形为使得当电池,拉片和壳体被压缩在一起时,电池和壳体的至少一个区域彼此暴露。 粘合剂层被成形为覆盖至少一个暴露区域,使得电池粘附到壳体,并且拉片被加强,以便在用于从便携式计算设备移除电池时防止拉片撕裂。 其他电池去除装置包括拉绳电池去除装置以及同时包括拉片和一个或多个拉绳的电池去除装置。

    BATTERY FOR ROUTING SIGNALS
    7.
    发明申请
    BATTERY FOR ROUTING SIGNALS 有权
    用于路由信号的电池

    公开(公告)号:US20170054129A1

    公开(公告)日:2017-02-23

    申请号:US14832989

    申请日:2015-08-21

    Applicant: Apple Inc.

    CPC classification number: H01M2/30 G06F1/26 H01M2/1016 H01M2/1066 H01M10/4257

    Abstract: This application relates to batteries that are capable of routing signals that are separate from the charge supplied by the batteries. In some embodiments, a battery can incorporate a conductive trace that extends through a portion of the battery to allow for signals to be routed through the battery, as opposed to around the battery. The conductive trace can be a single wire, multiple wires, a coaxial trace, optical cable, or any other mechanism for allowing a signal to be transmitted between one or more components. By providing the conductive trace within the battery, shorter pathways to components can be created thereby reducing signal or power loss over the pathways.

    Abstract translation: 本申请涉及能够路由与电池提供的电荷分离的信号的电池。 在一些实施例中,电池可以包括延伸穿过电池的一部分的导电迹线,以允许信号通过电池被路由,而不是电池周围。 导电迹线可以是单线,多条线,同轴线,光缆或用于允许信号在一个或多个部件之间传输的任何其它机构。 通过在电池内提供导电迹线,可以创建到组件的较短路径,从而减少路径上的信号或功率损耗。

    METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE
    8.
    发明申请
    METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE 有权
    从水分屏蔽电子元件的方法

    公开(公告)号:US20150060110A1

    公开(公告)日:2015-03-05

    申请号:US14230639

    申请日:2014-03-31

    Applicant: Apple Inc.

    Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

    Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地,疏水涂层可以通过等离子体辅助化学气相沉积(PACVD)方法施加到完全组装的电路板上。 通常,完全组装的电路板可以具有各种部件,例如覆盖水敏电子器件的电磁干扰(EMI)屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中,板对板连接器的焊接引线可以被硅树脂密封覆盖。

    DISTRIBUTED AUXILIARY HUB FOR A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20210072801A1

    公开(公告)日:2021-03-11

    申请号:US16818680

    申请日:2020-03-13

    Applicant: Apple Inc.

    Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.

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