公开(公告)号：US10691169B2

公开(公告)日：2020-06-23

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  G04B37/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/402 ,  H01Q1/24 ,  B28D5/00 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08 ,  B23K103/00

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US09977464B2

公开(公告)日：2018-05-22

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  H01Q1/24 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/364 ,  B05D1/02 ,  B23K26/402 ,  B24C1/08 ,  G04B37/00 ,  B23K103/00

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US20180284843A1

公开(公告)日：2018-10-04

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dele N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B24B37/04 ,  B05D1/02 ,  B23K26/402 ,  G04B39/00 ,  G04B37/00 ,  B24C11/00 ,  B24C1/08 ,  B23K26/364 ,  B24B29/00 ,  B24B7/22 ,  B23K103/00 ,  H01Q1/24

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US20160062405A1

公开(公告)日：2016-03-03

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B23K26/402 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Abstract translation: 公开了一种用于电子设备的盖和形成盖的方法。 电子设备可以包括壳体和联接到壳体的盖。 盖可以具有内表面，其具有中间抛光剂和最终抛光剂中的至少一种，形成在内表面上的凹槽和与内表面相对定位的外表面。 外表面可以具有中间抛光剂和最终抛光剂中的至少一种。 盖子还可以具有形成在内表面和外表面之间的圆形周边部分。 圆形的周边部分可以邻近凹槽定位。 用于形成盖的方法可以包括使用抛光工具对蓝宝石部件进行第一抛光处理，并且使用喷砂介质对形成盖的蓝宝石部件的凹槽进行第二抛光处理。