公开(公告)号：US20210213587A1

公开(公告)日：2021-07-15

申请号：US17071865

申请日：2020-10-15

Applicant: Apple Inc.

Inventor： Vaibhav D. Patel ,  John P. Staton ,  Jonathan M. Manzano ,  Stephen P. Bathurst

IPC: B24B41/06 ,  B24B41/00

Abstract: Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.